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DAC7724NB/750G4

Texas Instruments

DAC7724NB/750G4 by Texas Instruments

DAC7724NB/750G4 by Texas Instruments is a 12-bit D/A converter with 10V max analog output voltage, 0.024% linearity error, and 0.1 MHz sample rate. Ideal for industrial applications requiring precise analog signal generation in a compact chip carrier package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,934 parts In-Stock

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7,934

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Digiode

USA . 3,238 parts In-Stock

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3,238

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Nova Conductors

Japan . 900 parts In-Stock

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900

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Distributors (Availability)

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AZTECH Wire

Italy . 537 parts In-Stock

1+ parts

$7.394

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-

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537

$7.394

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Parana Technologies

USA . 1,309 parts In-Stock

1+ parts

$23.119

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$23.754

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1,309

$23.119

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$23.754

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ChromeModa Solutions

Germany . 4,770 parts In-Stock

1+ parts

$25.976

100+ parts

$21.300

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4,770

$25.976

$21.300

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IDEA Electronic Components Group

UK . 1,722 parts In-Stock

1+ parts

$25.976

100+ parts

$24.677

1k+ parts

$23.378

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1,722

$25.976

$24.677

$23.378

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Ampacity Inc.

Singapore . 1,446 parts In-Stock

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$36.000

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1,446

$36.000

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One Stop Electronics

USA . 1,552 parts In-Stock

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$38.000

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1,552

$38.000

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Component Stockers USA

USA . 393 parts In-Stock

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$99.990

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393

$99.990

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Microchip USA

USA . 11,439 parts In-Stock

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11,439

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Continental Prestige Electronics

USA . 6,401 parts In-Stock

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Corphita

USA . 3,959 parts In-Stock

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Argo Parts USA

USA . 2,809 parts In-Stock

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DigiPath Technology Company

USA . 1,383 parts In-Stock

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$23.420

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1,383

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$23.420

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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Overview

Elevate your projects with the DAC7724NB/750G4 by Texas Instruments, a top-tier Digital-to-Analog Converter that delivers unparalleled precision and reliability. Manufactured by industry leader Texas Instruments, this innovative converter boasts 12 bits of resolution and a maximum analog output voltage of 10V, making it ideal for a wide range of applications. With a compact square package design and advanced CMOS technology, the DAC7724NB/750G4 offers exceptional performance and efficiency. Experience the value of high-quality engineering and unlock endless possibilities with this cutting-edge converter.

Feature Benefit Bullets

Maximum Analog Output Voltage: 10 V

Allows for a wide range of output voltages, making it suitable for various applications.

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight package for the converter.

Surface Mount: YES

Enables easy and space-saving installation on circuit boards.

No. of Functions: 4

Offers multiple functions in a single converter, increasing versatility.

Package Shape: SQUARE

Allows for efficient and compact arrangement on PCBs.

No. of Bits: 12

Provides high resolution and accuracy in converting digital signals to analog.

Maximum Settling Time: 10 us

Ensures fast response time and accurate output voltage settling.

Maximum Linearity Error (EL): 0.024 %

Ensures minimal error in the converted analog signal.

Power Supplies (V): 5,15/+-15

Offers a wide range of power supply options for flexibility in various operating conditions.

No. of Terminals: 28

Provides multiple connection points for interfacing with other components.

Package Style (Meter): CHIP CARRIER

Provides a compact and efficient package style for the converter.

Nominal Settling Time (tstl): 10 us

Consistent settling time for accurate and stable output voltage.

Maximum Operating Temperature: 85 °C

Can operate in high-temperature environments without performance degradation.

Minimum Operating Temperature: -40 °C

Suitable for operation in extremely cold environments as well.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides a reliable and durable terminal finish for long-term performance.

Terminal Position: QUAD

Efficiently arranges terminals for easy connection and installation.

Maximum Seated Height: 4.57 mm

Provides a low-profile design for compact and space-saving installations.

Width: 11.51 mm

Compact width for efficient PCB layout and space utilization.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering and reliability during assembly process.

Peak Reflow Temperature °C: 245

Can withstand high reflow temperatures during soldering process.

Minimum Analog Output Voltage: -10 V

Provides a wide range of output voltages, including negative values for versatility.

Length: 11.51 mm

Compact length for efficient PCB layout and space utilization.

Temperature Grade: INDUSTRIAL

Suitable for industrial environments with varying temperature conditions.

Sample Rate: 0.1 MHz

Provides fast and accurate conversion of digital signals to analog.

Technology: CMOS

Utilizes CMOS technology for efficient power consumption and high performance.

Terminal Form: J BEND

Facilitates easy and secure soldering of terminals on PCBs.

Maximum Supply Current: 8.5 mA

Low power consumption for energy-efficient operation.

Converter Type: D/A CONVERTER

Specifically designed for digital-to-analog conversion applications.

Nominal Negative Supply Voltage: -15 V

Offers a stable negative supply voltage option for versatile operation.

Terminal Pitch: 1.27 mm

Optimal terminal pitch for easy and efficient PCB layout.

Moisture Sensitivity Level (MSL): 3

Suitable for storage and operation in moderate humidity environments.

Input Bit Code: BINARY

Compatible with binary input signals for accurate conversion.

Technical Specifications

Digital-to-Analog Converters DAC7724NB/750G4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.024 %

Nominal Settling Time (tstl):

10 µs

Maximum Supply Current:

8.5 mA

Maximum Settling Time:

10 µs

Sample Rate:

100 kHz

No. of Bits:

12

No. of Functions:

4

Electrical Specifications

Minimum Analog Output Voltage:

-10 V

Maximum Analog Output Voltage:

10 V

Power Supplies:

5,15/±15 V

Nominal Negative Supply Voltage:

-15 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

245 °C (473 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

3

Form Factor

No. of Terminals:

28

Terminal Form:

Terminal Position:

Quad

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.453 in (11.51 mm)

Length:

0.453 in (11.51 mm)

Maximum Seated Height:

0.18 in (4.57 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Chip Carrier

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Standards and Codes

Qualified:

No

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e4

Trade Compliance

DAC7724NB/750G4 Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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