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DAC7634EBG4

Texas Instruments

DAC7634EBG4 by Texas Instruments

DAC7634EBG4 by Texas Instruments is a 16-bit D/A converter with max analog output voltage of 2.5V and settling time of 10us. Ideal for industrial applications, it operates at temperatures ranging from -40 to 85°C and features a small outline package with dual terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,753 parts In-Stock

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Vyrian

USA . 2,872 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 489 parts In-Stock

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$8.715

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489

$8.715

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Northwest PG Solutions

USA . 1,922 parts In-Stock

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$9.587

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$8.628

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$9.587

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AZTECH Wire

Italy . 401 parts In-Stock

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$19.628

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$19.628

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One Stop Electronics

USA . 513 parts In-Stock

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$21.000

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513

$21.000

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Parana Technologies

USA . 2,329 parts In-Stock

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$23.851

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$24.483

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$23.851

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DigiPath Technology Company

USA . 797 parts In-Stock

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$26.263

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$24.162

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797

$26.263

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ChromeModa Solutions

Germany . 4,583 parts In-Stock

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$26.799

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$21.975

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IDEA Electronic Components Group

UK . 1,444 parts In-Stock

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$26.799

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$25.459

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$24.119

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Corphita

USA . 3,546 parts In-Stock

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Microchip USA

USA . 2,305 parts In-Stock

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Overview

Unleash the power of precision with the Texas Instruments DAC7634EBG4 digital-to-analog converter. Renowned for their superior quality and reliability, Texas Instruments delivers cutting-edge technology in a small outline package. With a wide range of applications in industries such as automotive, industrial automation, and telecommunications, this D/A converter offers unmatched performance and accuracy. Experience seamless integration, high resolution, and fast settling time with the DAC7634EBG4, providing customers with exceptional value and unparalleled benefits. Elevate your projects with Texas Instruments and unlock limitless possibilities.

Feature Benefit Bullets

Maximum Analog Output Voltage: 2.5 V

High maximum analog output voltage allows for a wide range of signal levels to be accurately converted.

No. of Bits: 16

With 16 bits, this digital-to-analog converter can provide high resolution and accuracy in converting digital signals to analog.

Maximum Linearity Error (EL): 0.0046 %

Low linearity error ensures that the output closely matches the input signal, resulting in accurate conversion.

Power Supplies (V): 5/+-5

Support for dual power supplies at 5V and +/-5V allows for flexibility in system integration and operation.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this converter can be used in a wide range of industrial environments.

Input Format: SERIAL

Serial input format provides a convenient and efficient way to interface with other digital systems.

Nominal Supply Voltage: 5 V

Standard 5V supply voltage ensures compatibility with common power sources and systems.

Technical Specifications

Digital-to-Analog Converters DAC7634EBG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.0046 %

Nominal Settling Time (tstl):

10 µs

Maximum Supply Current:

2 mA

Maximum Settling Time:

10 µs

Sample Rate:

89 kHz

No. of Bits:

16

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

5 V

Minimum Analog Output Voltage:

-2.5 V

Maximum Analog Output Voltage:

2.5 V

Power Supplies:

5/±5 V

Nominal Negative Supply Voltage:

-5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

3

Form Factor

No. of Terminals:

48

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.025 in (0.635 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.295 in (7.49 mm)

Length:

0.625 in (15.875 mm)

Maximum Seated Height:

0.11 in (2.79 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline, Shrink Pitch

Package Code:

Package Equivalence Code:

SSOP48,.4

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Trade Compliance

DAC7634EBG4 Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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