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DAC7573IPWG4

Texas Instruments

DAC7573IPWG4 by Texas Instruments

DAC7573IPWG4 by Texas Instruments is a 12-bit D/A converter with max analog output voltage of 5.5V and settling time of 10us. Ideal for industrial applications, it operates b/w -40 to 85°C, with low power consumption at 0.9mA.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,156 parts In-Stock

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4,156

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Vyrian

USA . 3,129 parts In-Stock

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3,129

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Distributors (Availability)

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Northwest PG Solutions

USA . 1,899 parts In-Stock

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$3.017

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1,899

$3.017

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Parana Technologies

USA . 1,435 parts In-Stock

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$6.042

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$6.820

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$6.042

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$6.820

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DigiPath Technology Company

USA . 847 parts In-Stock

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$6.653

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$6.121

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847

$6.653

$6.121

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ChromeModa Solutions

Germany . 3,335 parts In-Stock

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$6.789

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$5.567

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$6.789

$5.567

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IDEA Electronic Components Group

UK . 1,453 parts In-Stock

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$6.789

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$6.110

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$6.789

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$6.110

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AZTECH Wire

Italy . 349 parts In-Stock

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$9.909

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349

$9.909

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One Stop Electronics

USA . 1,587 parts In-Stock

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$19.000

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Corphita

USA . 4,782 parts In-Stock

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Microchip USA

USA . 485 parts In-Stock

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Native Components

USA . 424 parts In-Stock

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$2.661

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424

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Overview

Experience unparalleled precision and reliability with the Texas Instruments DAC7573IPWG4 Digital-to-Analog Converter. Crafted by a renowned manufacturer, this top-of-the-line product offers seamless integration and outstanding performance in a wide range of industrial applications. Elevate your projects with the superior quality and efficiency that this converter provides, delivering exceptional value and benefits to all customers who choose excellence.

Feature Benefit Bullets

Maximum Analog Output Voltage: 5.5 V

This high maximum analog output voltage allows for a wide range of output signals, making this product versatile for various applications.

No. of Bits: 12

With 12 bits, this digital-to-analog converter provides high resolution and accuracy in converting digital signals to analog, resulting in precise output.

Maximum Settling Time: 10 us

The fast settling time of 10 microseconds ensures quick and accurate conversion, making this product suitable for applications requiring real-time signal processing.

Power Supplies (V): 3/5

This product can operate on either 3V or 5V power supplies, providing flexibility in integration with different systems or circuits.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature range (-40°C to 85°C) ensures reliability and stability of operation in harsh environmental conditions, making it suitable for industrial applications.

Technology: CMOS

Utilizing CMOS technology allows for low power consumption and high noise immunity, enhancing the efficiency and reliability of this digital-to-analog converter.

Technical Specifications

Digital-to-Analog Converters DAC7573IPWG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.1953 %

Nominal Settling Time (tstl):

12 µs

Maximum Supply Current:

900 μA

Maximum Settling Time:

10 µs

No. of Bits:

12

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

5.5 V

Power Supplies:

3/5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

1

Form Factor

No. of Terminals:

16

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.173 in (4.4 mm)

Length:

0.197 in (5 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Code:

Package Equivalence Code:

TSSOP16,.25

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Trade Compliance

DAC7573IPWG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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