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DAC7558IRHBTG4

Texas Instruments

DAC7558IRHBTG4 by Texas Instruments

DAC7558IRHBTG4 by Texas Instruments is a 12-bit D/A converter with 5.5V max analog output voltage and 0V min analog output voltage. It operates at industrial temperature grade, has a sample rate of 0.5MHz, and is ideal for applications requiring precise analog signal generation in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 10,500 parts In-Stock

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Vyrian

USA . 7,417 parts In-Stock

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Digiode

USA . 3,932 parts In-Stock

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Euro-Tech

UK . 250 parts In-Stock

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AZTECH Wire

Italy . 539 parts In-Stock

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$9.635

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539

$9.635

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Parana Technologies

USA . 1,859 parts In-Stock

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$19.229

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$1,785.736

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$17.306

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1,859

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$1,785.736

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DigiPath Technology Company

USA . 871 parts In-Stock

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$21.174

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871

$21.174

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ChromeModa Solutions

Germany . 6,374 parts In-Stock

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$21.606

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$17.717

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$21.606

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IDEA Electronic Components Group

UK . 131 parts In-Stock

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$21.606

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$20.526

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$19.445

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Native Components

USA . 11 parts In-Stock

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$28.660

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Northwest PG Solutions

USA . 842 parts In-Stock

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$31.526

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$28.373

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One Stop Electronics

USA . 1,638 parts In-Stock

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$32.000

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QUARKTWIN TECHNOLOGY LTD

USA . 8,046 parts In-Stock

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Corphita

USA . 1,476 parts In-Stock

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Microchip USA

USA . 1,134 parts In-Stock

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GreenTree Electronics

Israel . 604 parts In-Stock

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Overview

Unlock the power of precision with the Texas Instruments DAC7558IRHBTG4 Digital-to-Analog Converter. Built by a trusted manufacturer, this cutting-edge device offers unparalleled quality and reliability in a wide range of applications. Whether you're working on industrial automation, telecommunications, or automotive electronics, this converter delivers exceptional performance with its fast settling time and low linearity error. With a compact package and multiple terminals, it's easy to integrate into your projects while providing a stable output voltage. Trust in Texas Instruments to bring you the best in digital-to-analog conversion technology, ensuring optimal results and value for your customers.

Feature Benefit Bullets

Maximum Analog Output Voltage: 5.5 V

Provides a high maximum output voltage for versatile applications.

No. of Bits: 12

Higher number of bits provide greater resolution and accuracy in digital-to-analog conversion.

Maximum Settling Time: 5 us

Fast settling time ensures quick response and accurate output.

Power Supplies (V): 3/5

Supports multiple power supply options for flexibility in different setups.

Maximum Operating Temperature: 105 °C

Wide operating temperature range suitable for industrial environments.

Sample Rate: 0.5 MHz

High sample rate allows for precise conversion of digital signals to analog.

Technical Specifications

Digital-to-Analog Converters DAC7558IRHBTG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary, 2's Complement Binary

Maximum Linearity Error (EL):

0.0244 %

Nominal Settling Time (tstl):

5 µs

Maximum Supply Current:

1.8 mA

Maximum Settling Time:

5 µs

Sample Rate:

500 kHz

No. of Bits:

12

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

5.5 V

Power Supplies:

3/5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

105 °C (221 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

2

Form Factor

No. of Terminals:

32

Terminal Form:

Terminal Position:

Quad

Terminal Pitch:

0.02 in (0.5 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.197 in (5 mm)

Length:

0.197 in (5 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Standards and Codes

Qualified:

No

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Trade Compliance

DAC7558IRHBTG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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