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DAC7553IRGTRG4

Texas Instruments

DAC7553IRGTRG4 by Texas Instruments

DAC7553IRGTRG4 by Texas Instruments is a 12-bit D/A converter with max analog output voltage of 5.5V and settling time of 5us. Ideal for industrial applications, it operates b/w -40 to 105°C, has a sample rate of 1MHz, and consumes only 0.44mA supply current.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Chip Stock

USA . 7,500 parts In-Stock

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7,500

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Vyrian

USA . 6,394 parts In-Stock

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6,394

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Digiode

USA . 3,449 parts In-Stock

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3,449

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Nova Conductors

Japan . 900 parts In-Stock

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900

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Corohmni

South Africa . 12 parts In-Stock

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$5.047

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12

$5.047

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Parana Technologies

USA . 926 parts In-Stock

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$7.603

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$8.114

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926

$7.603

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$8.114

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AZTECH Wire

Italy . 381 parts In-Stock

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$8.207

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$8.207

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DigiPath Technology Company

USA . 979 parts In-Stock

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$8.372

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$7.702

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979

$8.372

$7.702

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ChromeModa Solutions

Germany . 3,524 parts In-Stock

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$8.543

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$7.005

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$8.543

$7.005

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IDEA Electronic Components Group

UK . 2,273 parts In-Stock

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$8.543

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$8.116

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$7.689

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$7.689

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Ampacity Inc.

Singapore . 434 parts In-Stock

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$29.000

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One Stop Electronics

USA . 405 parts In-Stock

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$32.000

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$32.000

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Semicontronic

India . 1,318 parts In-Stock

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$34.000

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$33.150

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$32.980

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Perfect Parts

USA . 6,720 parts In-Stock

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GreenTree Electronics

Israel . 4,825 parts In-Stock

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Corphita

USA . 2,537 parts In-Stock

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Argo Parts USA

USA . 1,512 parts In-Stock

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Microchip USA

USA . 1,156 parts In-Stock

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Continental Prestige Electronics

USA . 563 parts In-Stock

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563

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Bastille Electronics

Australia . 200 parts In-Stock

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Overview

Unlock the power of precision with the Texas Instruments DAC7553IRGTRG4 Digital-to-Analog Converter. Crafted with top-quality materials and cutting-edge technology, this converter promises unparalleled performance in a compact package. Ideal for industrial applications requiring fast settling times and high accuracy, this product offers a seamless solution for your analog signal needs. Trust Texas Instruments to deliver superior quality and reliability, ensuring value and efficiency for your projects. Elevate your designs with the DAC7553IRGTRG4 and experience excellence like never before.

Feature Benefit Bullets

Maximum Analog Output Voltage: 5.5 V

With a high maximum analog output voltage, this converter can provide a wide range of output levels for greater flexibility in signal processing.

No. of Bits: 12

The 12-bit resolution ensures high accuracy in converting digital signals to analog, making it suitable for applications that require precise voltage levels.

Maximum Settling Time: 5 us

The fast settling time of 5 microseconds ensures minimal delay in producing accurate analog outputs, ideal for time-sensitive applications.

Power Supplies (V): 3/5

Supports multiple power supply options (3V or 5V), providing compatibility with different systems and voltage requirements.

Sample Rate: 1 MHz

High sample rate of 1 MHz allows for fast and efficient conversion of digital signals to analog, suitable for high-speed applications.

Technical Specifications

Digital-to-Analog Converters DAC7553IRGTRG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

2's Complement

Maximum Linearity Error (EL):

0.0244 %

Nominal Settling Time (tstl):

5 µs

Maximum Supply Current:

440 μA

Maximum Settling Time:

5 µs

Sample Rate:

1 MHz

No. of Bits:

12

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

5.5 V

Power Supplies:

3/5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

105 °C (221 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

3

Form Factor

No. of Terminals:

16

Terminal Form:

Terminal Position:

Quad

Terminal Pitch:

0.02 in (0.5 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.118 in (3 mm)

Length:

0.118 in (3 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Standards and Codes

Qualified:

No

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Trade Compliance

DAC7553IRGTRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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