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DAC7541AKU/1KG4

Texas Instruments

DAC7541AKU/1KG4 by Texas Instruments

DAC7541AKU/1KG4 by Texas Instruments is a 12-bit D/A converter with 0.0244% linearity error and 0.6 us settling time. It operates at 15V, suitable for commercial applications requiring precise analog signal generation in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 7,622 parts In-Stock

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Digiode

USA . 3,201 parts In-Stock

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AZTECH Wire

Italy . 603 parts In-Stock

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$7.433

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One Stop Electronics

USA . 503 parts In-Stock

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$12.000

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Parana Technologies

USA . 1,297 parts In-Stock

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$23.788

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$24.420

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DigiPath Technology Company

USA . 1,608 parts In-Stock

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$26.193

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$24.098

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ChromeModa Solutions

Germany . 3,545 parts In-Stock

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$26.728

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$21.917

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IDEA Electronic Components Group

UK . 443 parts In-Stock

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$26.728

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$25.392

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$24.055

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Component Stockers USA

USA . 284 parts In-Stock

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$99.990

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Corphita

USA . 3,216 parts In-Stock

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Northwest PG Solutions

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Native Components

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Microchip USA

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Overview

Unlock the power of precision with the DAC7541AKU/1KG4 by Texas Instruments. As a leader in digital-to-analog converters, Texas Instruments ensures top-quality manufacturing and cutting-edge technology in every product. Ideal for a wide range of applications, this converter offers unparalleled accuracy and reliability. Say goodbye to compromise and hello to seamless performance with the DAC7541AKU/1KG4. Experience the value and benefits this exceptional product brings to your projects today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it ideal for portable or rugged applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying the assembly process.

No. of Bits: 12

With 12 bits of resolution, the DAC offers high precision and accuracy in converting digital signals to analog, resulting in high-quality output.

Power Supplies (V): 15

Operating at a power supply voltage of 15V ensures compatibility with common power sources, making it easy to incorporate into existing systems.

Nominal Settling Time (tstl): 0.6 us

The fast settling time of 0.6 microseconds ensures quick response and accurate output voltage, making it suitable for real-time applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the DAC energy-efficient and reliable in various operating environments.

Nominal Supply Voltage: 15 V

Operating at a nominal supply voltage of 15V ensures stable performance and compatibility with standard power sources, simplifying integration into systems.

Technical Specifications

Digital-to-Analog Converters DAC7541AKU/1KG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Parallel, Word

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.0244 %

Nominal Settling Time (tstl):

600 ns

Maximum Supply Current:

2 mA

No. of Bits:

12

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

15 V

Power Supplies:

15 V

Operating Conditions

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Form Factor

No. of Terminals:

18

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.295 in (7.5 mm)

Length:

0.455 in (11.55 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline

Package Code:

SOP

Package Equivalence Code:

SOP18,.4

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G18

Trade Compliance

DAC7541AKU/1KG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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