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DAC70501ZDGST

Texas Instruments

DAC70501ZDGST by Texas Instruments

D/A CONVERTER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 10; Package Code: TSSOP; Package Shape: SQUARE;

Median Price

$5.504

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 10,473 parts In-Stock

1+ parts

$4.668

100+ parts

$4.090

1k+ parts

$2.311

10k+ parts

-

10,473

$4.668

$4.090

$2.311

-

DigiKey

USA . 226 parts In-Stock

1+ parts

$6.340

100+ parts

$4.098

1k+ parts

$3.731

10k+ parts

$3.593

226

$6.340

$4.098

$3.731

$3.593

Mouser Electronics

USA . 86 parts In-Stock

1+ parts

$6.340

100+ parts

$4.100

1k+ parts

$3.610

10k+ parts

-

86

$6.340

$4.100

$3.610

-

Arrow

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.029

10k+ parts

$2.814

250

-

-

$3.029

$2.814

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 180 parts In-Stock

1+ parts

$4.435

100+ parts

-

1k+ parts

-

10k+ parts

-

180

$4.435

-

-

-

Vyrian

USA . 6,350 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,350

-

-

-

-

TME

Poland . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.359

10k+ parts

-

250

-

-

$4.359

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 781 parts In-Stock

1+ parts

$4.201

100+ parts

-

1k+ parts

-

10k+ parts

-

781

$4.201

-

-

-

Component Stockers USA

USA . 10,105 parts In-Stock

1+ parts

$5.990

100+ parts

$4.410

1k+ parts

$2.460

10k+ parts

$2.460

10,105

$5.990

$4.410

$2.460

$2.460

Advanced Electronics

New Zealand . 2,636 parts In-Stock

1+ parts

$13.142

100+ parts

$11.959

1k+ parts

$10.776

10k+ parts

-

2,636

$13.142

$11.959

$10.776

-

Corohmni

South Africa . 25 parts In-Stock

1+ parts

$14.494

100+ parts

-

1k+ parts

-

10k+ parts

-

25

$14.494

-

-

-

Parana Technologies

USA . 383 parts In-Stock

1+ parts

$18.027

100+ parts

-

1k+ parts

$18.178

10k+ parts

-

383

$18.027

-

$18.178

-

DigiPath Technology Company

USA . 2,355 parts In-Stock

1+ parts

$19.850

100+ parts

$18.262

1k+ parts

-

10k+ parts

-

2,355

$19.850

$18.262

-

-

ChromeModa Solutions

Germany . 3,280 parts In-Stock

1+ parts

$20.255

100+ parts

$16.609

1k+ parts

-

10k+ parts

-

3,280

$20.255

$16.609

-

-

IDEA Electronic Components Group

UK . 1,947 parts In-Stock

1+ parts

$20.255

100+ parts

$19.242

1k+ parts

$18.230

10k+ parts

-

1,947

$20.255

$19.242

$18.230

-

Native Components

USA . 400 parts In-Stock

1+ parts

$30.670

100+ parts

-

1k+ parts

-

10k+ parts

$29.443

400

$30.670

-

-

$29.443

Northwest PG Solutions

USA . 454 parts In-Stock

1+ parts

$33.737

100+ parts

-

1k+ parts

-

10k+ parts

-

454

$33.737

-

-

-

Technical Specifications

Digital-to-Analog Converters DAC70501ZDGST attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.0061 %

Nominal Settling Time (tstl):

5 µs

Maximum Settling Time:

5 µs

No. of Bits:

14

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

5 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

5.5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

2

Form Factor

No. of Terminals:

10

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.02 in (0.5 mm)

Terminal Finish:

Nickel Palladium Gold Silver

Surface Mount:

Yes

Width:

0.118 in (3 mm)

Length:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Code:

Standards and Codes

JESD-30 Code:

S-PDSO-G10

JESD-609 Code:

e4

Trade Compliance

DAC70501ZDGST Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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