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DAC5687EVM

Texas Instruments

DAC5687EVM by Texas Instruments

DAC5687EVM by Texas Instruments features 2 DACs with 16-bit resolution, 500MSPS sampling rate, and 10.4ns settling time. It is used for evaluating DAC5687 IC in current output mode. Ideal for high-speed parallel data interface applications.

Median Price

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Lifecycle Status

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2

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1k+

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Vyrian

USA . 7,069 parts In-Stock

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Digiode

USA . 3,474 parts In-Stock

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AZTECH Wire

Italy . 876 parts In-Stock

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$7.156

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Ampacity Inc.

Singapore . 913 parts In-Stock

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One Stop Electronics

USA . 867 parts In-Stock

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Native Components

USA . 605 parts In-Stock

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$134.400

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Northwest PG Solutions

USA . 374 parts In-Stock

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Semicontronic

India . 741 parts In-Stock

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$189.248

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$188.277

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Corphita

USA . 4,249 parts In-Stock

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ChromeModa Solutions

Germany . 2,547 parts In-Stock

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Parana Technologies

USA . 2,105 parts In-Stock

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DigiPath Technology Company

USA . 1,982 parts In-Stock

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Corohmni

South Africa . 245 parts In-Stock

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IDEA Electronic Components Group

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Overview

Unlock the power of precision with the DAC5687EVM by Texas Instruments. As a leader in semiconductor manufacturing, Texas Instruments delivers top-quality development boards for digital to analog converters (DACs). This Evaluation Board features two 16-bit DACs with a lightning-fast sampling rate of 500M per second, perfect for high-performance applications. With a parallel data interface and current DAC type, the DAC5687EVM offers unparalleled accuracy and speed. Take your projects to the next level with the reliable and versatile DAC5687EVM from Texas Instruments.

Feature Benefit Bullets

Other Names: 296-18682-ND

This product is easy to identify and locate when ordering or researching online with this unique reference.

Category: Development Boards, Kits, Programmers Evaluation Boards

This product is ideal for evaluating and testing digital to analog converters in a development environment.

Package: Bulk

Bulk packaging is cost-effective for purchasing multiple units or for production purposes.

Number of DAC's: 2

Having two DACs provides flexibility for testing and comparison purposes.

Number of Bits: 16

The 16-bit resolution ensures accurate and precise analog output.

Sampling Rate (Per Second): 500M

The high sampling rate allows for fast and efficient conversion of digital signals to analog output.

Data Interface: Parallel

Parallel data interface enables fast and efficient communication between the DACs and the host system.

Settling Time: 10.4 ns

The quick settling time ensures stable and accurate output signals after each conversion.

DAC Type: Current

Current DACs offer high linearity and low noise for high-quality analog output.

Supplied Contents: Board(s)

The board(s) provided with the product facilitate easy setup and connection for evaluation and testing.

Utilized IC / Part: DAC5687

The use of the DAC5687 IC ensures compatibility and optimized performance with the evaluation boards.

Base Product Number: DAC5687

This product is based on the DAC5687 IC, known for its high performance and quality in DACs.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

The unlimited MSL rating means that the product is not sensitive to moisture, ensuring reliability and durability in various environments.

Technical Specifications

Additional Parts DAC5687EVM attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

-296-18682-ND
296-18682
296-18682-NDR
-DAC5687EVM-NDR
-296-18682

Category:

Development Boards, Kits, Programmers
Evaluation Boards Digital to Analog Converters (DACs) Evaluation Boards

Data Interface:

Parallel

Settling Time:

10.4 ns

Standard Package:

1

DAC Type:

Current

Number of DAC's:

2

Supplied Contents:

Board(s)

Number of Bits:

16

Utilized IC / Part:

DAC5687

Package:

Bulk

Sampling Rate (Per Second):

500M

Base Product Number:

DAC5687

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

DAC5687EVM Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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