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DAC3174EVM

Texas Instruments

DAC3174EVM by Texas Instruments

DAC3174EVM by Texas Instruments features 2 DACs with 14-bit resolution and a sampling rate of 500MSPS. It utilizes DDR LVDS data interface, settling time of 11ns, and is ideal for evaluating Current DAC3174 IC in various applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 5,533 parts In-Stock

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Digiode

USA . 53 parts In-Stock

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Native Components

USA . 428 parts In-Stock

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$0.936

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428

$0.936

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Northwest PG Solutions

USA . 2,335 parts In-Stock

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$1.030

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AZTECH Wire

Italy . 287 parts In-Stock

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$7.452

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Semicontronic

India . 629 parts In-Stock

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$56.100

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$54.698

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$54.417

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629

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One Stop Electronics

USA . 1,453 parts In-Stock

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$116.100

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$116.100

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Ampacity Inc.

Singapore . 1,602 parts In-Stock

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$192.100

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IDEA Electronic Components Group

UK . 1,097 parts In-Stock

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ChromeModa Solutions

Germany . 1,062 parts In-Stock

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Parana Technologies

USA . 375 parts In-Stock

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$0.287

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Corohmni

South Africa . 354 parts In-Stock

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Corphita

USA . 325 parts In-Stock

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DigiPath Technology Company

USA . 131 parts In-Stock

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Perfect Parts

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Overview

Unlock the power of precision with the DAC3174EVM by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products with cutting-edge technology. The DAC3174EVM offers unparalleled performance and reliability for a wide range of applications. Whether you are working on development boards, kits, or programmers, this evaluation board provides exceptional value, benefits, and advantages to customers. Experience the difference with Texas Instruments and take your projects to the next level with the DAC3174EVM.

Feature Benefit Bullets

Other Names: 296-36186

Easy identification and reference for ordering or technical support purposes.

Number of DAC's: 2

Having two DACs allows for simultaneous conversion of multiple signals, providing flexibility in applications.

Number of Bits: 14

Higher number of bits allows for finer resolution and accuracy in converting digital signals to analog.

Sampling Rate (Per Second): 500M

High sampling rate enables real-time and high-speed signal processing.

Data Interface: DDR LVDS

DDR LVDS interface ensures high data transfer speeds and low power consumption.

Settling Time: 11 ns

Fast settling time allows for quick stabilization of analog output after a change in the digital input.

DAC Type: Current

Current output DACs provide high accuracy and stability in converting digital signals to analog currents.

Supplied Contents: Board(s)

Includes necessary boards for evaluation and testing, making it convenient for development and prototyping.

Utilized IC / Part: DAC3174

Utilizes DAC3174 IC for reliable and consistent performance in digital to analog conversion.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

Unlimited moisture sensitivity level ensures product reliability under various environmental conditions.

Technical Specifications

Additional Parts DAC3174EVM attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

296-36186

Category:

Development Boards, Kits, Programmers
Evaluation Boards Digital to Analog Converters (DACs) Evaluation Boards

Data Interface:

DDR LVDS

Settling Time:

11 ns

Standard Package:

1

DAC Type:

Current

Number of DAC's:

2

Supplied Contents:

Board(s)

Number of Bits:

14

Utilized IC / Part:

DAC3174

Package:

Box

Sampling Rate (Per Second):

500M

Base Product Number:

DAC3174

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

DAC3174EVM Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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