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DAC3151EVM

Texas Instruments

DAC3151EVM by Texas Instruments

DAC3151EVM by Texas Instruments is a 10-bit DAC Evaluation Board with 500MSPS sampling rate, LVDS data interface, and 11ns settling time. It is used for evaluating DAC3151 IC in current mode applications.

Median Price

$598.800

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1 parts In-Stock

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$598.800

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1

$598.800

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Digiode

USA . 50 parts In-Stock

1+ parts

$568.860

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50

$568.860

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Vyrian

USA . 6,858 parts In-Stock

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6,858

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1 parts In-Stock

1+ parts

$508.980

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1

$508.980

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Semicontronic

India . 1 parts In-Stock

1+ parts

$508.980

100+ parts

$496.256

1k+ parts

$493.711

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1

$508.980

$496.256

$493.711

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Corphita

USA . 3,421 parts In-Stock

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$538.920

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Corohmni

South Africa . 471 parts In-Stock

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$598.800

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471

$598.800

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ChromeModa Solutions

Germany . 2,172 parts In-Stock

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Parana Technologies

USA . 2,002 parts In-Stock

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$0.980

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2,002

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$0.980

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DigiPath Technology Company

USA . 1,115 parts In-Stock

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Native Components

USA . 827 parts In-Stock

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$3.274

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827

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$3.274

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Northwest PG Solutions

USA . 685 parts In-Stock

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$3.307

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685

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$3.307

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IDEA Electronic Components Group

UK . 199 parts In-Stock

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199

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Overview

Unlock the power of precision with the DAC3151EVM by Texas Instruments. This cutting-edge Evaluation Board offers unparalleled quality and reliability, backed by the trusted name of TI. Ideal for a wide range of applications in the Development Boards, Kits, and Programmers category, this product provides users with unmatched value and benefits. Experience seamless performance and efficiency with the DAC3151EVM, and take your projects to the next level.

Feature Benefit Bullets

Number of Bits: 10

Having 10 bits allows for higher resolution and more accurate conversion of digital signals to analog, making this product ideal for applications that require precise output.

Sampling Rate (Per Second): 500M

With a high sampling rate of 500M per second, this product is suitable for fast data acquisition and signal processing tasks that require real-time conversion of digital signals to analog.

Data Interface: LVDS - Parallel

The LVDS - Parallel data interface offers high-speed data transmission and parallel processing capabilities, making it suitable for applications that require efficient and rapid communication between digital and analog components.

Settling Time: 11 ns

The quick settling time of 11 ns ensures that the output of the DAC reaches its final value rapidly and accurately, making this product ideal for applications that require fast response times and high precision.

DAC Type: Current

The current DAC type offers high linearity and accuracy in converting digital signals to analog current, making this product suitable for applications that require precise control over current levels.

Supplied Contents: Board(s)

The supplied board(s) provide a ready-to-use platform for evaluating and testing the DAC3151 IC, making this product convenient for development and prototyping purposes.

Utilized IC / Part: DAC3151

The utilization of the DAC3151 IC ensures compatibility and optimized performance with this evaluation board, making it a reliable choice for testing and evaluating the capabilities of the DAC.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

With a moisture sensitivity level of 1 (unlimited), this product can be safely stored and handled in various environments without the risk of moisture damage, ensuring its durability and reliability over time.

Technical Specifications

Additional Parts DAC3151EVM attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

296-37162

Category:

Development Boards, Kits, Programmers
Evaluation Boards Digital to Analog Converters (DACs) Evaluation Boards

Data Interface:

LVDS - Parallel

Settling Time:

11 ns

Standard Package:

1

DAC Type:

Current

Number of DAC's:

1

Supplied Contents:

Board(s)

Number of Bits:

10

Utilized IC / Part:

DAC3151

Package:

Box

Sampling Rate (Per Second):

500M

Base Product Number:

DAC3151

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

DAC3151EVM Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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