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CY74FCT373TSOCTG4

Texas Instruments

CY74FCT373TSOCTG4 by Texas Instruments

CY74FCT373TSOCTG4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 8 ns at 5V. It features a small outline package, operates in industrial temperature range (-40 to 85 °C), and has a max seated height of 2.65 mm. Ideal for applications requiring high-speed data transfer in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,628 parts In-Stock

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Vyrian

USA . 1,926 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 429 parts In-Stock

1+ parts

$0.897

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429

$0.897

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Northwest PG Solutions

USA . 1,298 parts In-Stock

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$0.987

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$0.987

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Andel Nordic

Denmark . 693 parts In-Stock

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$5.955

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$5.716

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$5.716

693

$5.955

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$5.716

$5.716

Parana Technologies

USA . 470 parts In-Stock

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$9.631

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$894.356

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$8.668

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470

$9.631

$894.356

$8.668

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DigiPath Technology Company

USA . 167 parts In-Stock

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$10.605

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$9.756

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167

$10.605

$9.756

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IDEA Electronic Components Group

UK . 755 parts In-Stock

1+ parts

$10.821

100+ parts

$10.280

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$9.739

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755

$10.821

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$9.739

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ChromeModa Solutions

Germany . 541 parts In-Stock

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$10.821

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$8.873

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$10.821

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AZTECH Wire

Italy . 687 parts In-Stock

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$17.481

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One Stop Electronics

USA . 295 parts In-Stock

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$29.000

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Microchip USA

USA . 7,053 parts In-Stock

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Corphita

USA . 3,427 parts In-Stock

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Overview

Discover the superior quality and reliability of the CY74FCT373TSOCTG4 by Texas Instruments, a leading manufacturer in the industry. With applications in bus drivers & transceivers, this product offers unmatched value and benefits to customers. Experience fast propagation delay, 3-state output characteristics, and a small outline package design for easy integration. Trust in Texas Instruments for cutting-edge technology and industrial-grade performance. Elevate your projects with the CY74FCT373TSOCTG4 and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for use in various applications.

Propagation Delay At Nominal Supply: 8 ns

Low propagation delay ensures fast data transmission, making this product efficient for high-speed communication.

Surface Mount: YES

Surface mount capability allows for easy installation on PCBs, saving space and simplifying the assembly process.

Package Shape: RECTANGULAR

Rectangular shape makes the product easy to handle and integrate into existing circuit designs.

No. of Bits: 8

8-bit configuration provides sufficient data processing capability for many bus driver and transceiver applications.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage, compatible with most electronic systems.

Load Capacitance (CL): 50 pF

Suitable load capacitance for efficient signal transmission and reception in various communication protocols.

Power Supplies (V): 5

Consistent with the nominal supply voltage, ensuring stable performance and reliable operation.

No. of Terminals: 20

Sufficient number of terminals for easy connection and integration within a circuit layout.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and allows for compact circuit designs.

Maximum I (ol): 64 Amp

High output current capability for driving various loads without the need for additional external components.

Propagation Delay (tpd): 13 ns

Low propagation delay ensures fast and efficient data transmission between connected devices.

Maximum Operating Temperature: 85 °C

Wide operating temperature range makes the product suitable for use in industrial environments with varying conditions.

Output Characteristics: 3-STATE

3-state output allows for tristate logic operation, enabling multiple bus drivers to share a common bus line.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold conditions, making it suitable for applications in harsh environments.

Terminal Position: DUAL

Dual terminal position enhances connectivity options and flexibility in circuit layout designs.

No. of Ports: 2

Dual port configuration allows for bi-directional communication and connectivity with multiple devices.

Maximum Seated Height: 2.65 mm

Low seated height profile makes the product suitable for compact devices and space-constrained applications.

Width: 7.5 mm

Narrow width profile saves space on the PCB and enables dense circuit layouts.

Output Polarity: TRUE

True output polarity ensures compatibility with various logic levels and signal processing requirements.

Minimum Supply Voltage (Vsup): 4.75 V

Reliable operation even at low supply voltages, ensuring consistent performance in varying operating conditions.

Length: 12.8 mm

Compact length profile allows for easy integration into circuit layouts with limited space.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh industrial environments with fluctuating temperatures.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for efficient data transmission and signal integrity.

Terminal Form: GULL WING

Gull wing terminal form provides secure solder connections and enhances mechanical strength for reliable operation.

Packing Method: TR

Tape and reel packing method simplifies handling and assembly processes, ideal for automated production environments.

Terminal Pitch: 1.27 mm

Standard terminal pitch for easy integration into PCB designs and compatibility with common PCB fabrication processes.

Maximum Supply Voltage (Vsup): 5.25 V

Wide supply voltage range provides flexibility in power supply options and ensures compatibility with various system requirements.

Technical Specifications

Bus Driver & Transceivers CY74FCT373TSOCTG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

FCT

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

8 ns

Propagation Delay (tpd):

13 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

CY74FCT373TSOCTG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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