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CSM43XXXFN

Texas Instruments

CSM43XXXFN by Texas Instruments

CSM43XXXFN by Texas Instruments is a Speech Synthesizer IC in a square chip carrier package. Operates at 5V with 28 terminals, CMOS technology, and max supply current of 3mA. Ideal for music & sound applications due to its commercial temperature grade and J bend terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,235 parts In-Stock

1+ parts

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6,235

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Digiode

USA . 3,868 parts In-Stock

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3,868

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 413 parts In-Stock

1+ parts

$0.650

100+ parts

$60.334

1k+ parts

$0.585

10k+ parts

-

413

$0.650

$60.334

$0.585

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DigiPath Technology Company

USA . 1,710 parts In-Stock

1+ parts

$0.715

100+ parts

$0.658

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-

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1,710

$0.715

$0.658

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IDEA Electronic Components Group

UK . 2,209 parts In-Stock

1+ parts

$0.730

100+ parts

-

1k+ parts

$0.657

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2,209

$0.730

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$0.657

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ChromeModa Solutions

Germany . 1,722 parts In-Stock

1+ parts

$0.730

100+ parts

$0.599

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1,722

$0.730

$0.599

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One Stop Electronics

USA . 1,058 parts In-Stock

1+ parts

$7.800

100+ parts

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1,058

$7.800

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AZTECH Wire

Italy . 401 parts In-Stock

1+ parts

$12.496

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401

$12.496

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Corphita

USA . 3,960 parts In-Stock

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3,960

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Northwest PG Solutions

USA . 1,522 parts In-Stock

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$3.881

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1,522

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$3.881

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Native Components

USA . 364 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$3.841

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364

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$3.841

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Overview

Elevate your audio projects with the CSM43XXXFN by Texas Instruments, a premium quality Speech Synthesizer IC that promises exceptional performance and reliability. Manufactured by the renowned Texas Instruments, this chip carrier package boasts a durable plastic/epoxy body and quad terminal position for easy installation. Ideal for music and sound synthesizers, this IC operates at 5V and is designed for commercial-grade applications. Enhance your creations with the power and precision of Texas Instruments' CSM43XXXFN, offering unparalleled value and benefits to customers seeking top-tier audio solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the IC lightweight and cost-effective, making it a practical choice for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort during production.

Package Shape: SQUARE

The square package shape provides uniformity in design and facilitates easier placement on the circuit board.

General IC Type: SPEECH SYNTHESIZER

The speech synthesizer IC type offers the ability to generate human-like speech and vocal sounds, making it ideal for applications requiring voice output.

Power Supplies (V): 5

Operating at a standard 5V power supply makes the IC compatible with common voltage sources, ensuring easy integration into existing systems.

No. of Terminals: 28

Having a higher number of terminals allows for more connectivity options and features in the IC, increasing its versatility for use in different circuits.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers good thermal performance and efficient heat dissipation, enhancing the IC's reliability and longevity.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the IC can function reliably even in high-temperature environments, ensuring stability under varying conditions.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures down to 0°C makes the IC suitable for use in a wide range of environmental conditions.

Terminal Position: QUAD

The quad terminal position offers secure and stable connections, reducing the risk of signal loss or interference in the circuit.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature range means the IC is suitable for standard consumer electronics applications, making it widely applicable in various products.

Technology: CMOS

Using CMOS technology results in low power consumption and high noise immunity, enhancing the performance and efficiency of the IC.

Terminal Form: J BEND

The J bend terminal form is conducive to easy soldering and connection, ensuring reliable electrical contact and reducing the risk of solder joint failure.

Maximum Supply Current: 3 mA

With a maximum supply current of 3 mA, the IC operates efficiently and minimizes power consumption, making it suitable for battery-powered devices or energy-efficient applications.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for compact and dense PCB layout, optimizing space utilization and enabling the design of smaller and more compact electronic devices.

Technical Specifications

Music & Sound Synthesizer ICs CSM43XXXFN attributes and parameters. Explore more Music & Sound Synthesizer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQCC-J28

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Audio Synthesizer ICs

Maximum Supply Current:

3 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

CSM43XXXFN General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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