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CP3UB26G18NEP/NOPB

Texas Instruments

CP3UB26G18NEP/NOPB by Texas Instruments

CP3UB26G18NEP/NOPB by Texas Instruments is a 16-bit microcontroller with 8K data EEPROM, 262144 ROM words, and 8-channel 12-bit ADC. Ideal for industrial applications, it offers CAN, I2C, SPI connectivity and features low power mode with a max clock frequency of 12 MHz.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 5,987 parts In-Stock

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Digiode

USA . 5,152 parts In-Stock

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Anansix

USA . 287 parts In-Stock

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Native Components

USA . 149 parts In-Stock

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$2.112

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Northwest PG Solutions

USA . 512 parts In-Stock

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$2.323

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One Stop Electronics

USA . 768 parts In-Stock

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AZTECH Wire

Italy . 610 parts In-Stock

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Parana Technologies

USA . 2,159 parts In-Stock

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DigiPath Technology Company

USA . 2,001 parts In-Stock

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ChromeModa Solutions

Germany . 5,637 parts In-Stock

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$52.697

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IDEA Electronic Components Group

UK . 858 parts In-Stock

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Corphita

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Microchip USA

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Overview

Unlock the power of cutting-edge technology with the CP3UB26G18NEP/NOPB by Texas Instruments. As a leader in microcontroller innovation, Texas Instruments delivers top-quality products that drive advancements in various applications. From industrial automation to automotive electronics, this microcontroller offers unmatched performance and reliability. Experience seamless connectivity, low power consumption, and high-speed processing capabilities. Elevate your projects with the value and benefits that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the microcontroller.

Integrated Cache: YES

Having an integrated cache helps improve the speed and performance of the microcontroller.

Maximum Supply Voltage: 2.75 V

Allows for a higher supply voltage which can be useful for certain applications.

On Chip Data RAM Width: 8

Having a width of 8 allows for efficient data processing and storage.

Bit Size: 16

This microcontroller has a 16-bit architecture which can handle larger data sets and calculations.

No. of Terminals: 128

A higher number of terminals allows for more connectivity options and flexibility in designs.

ADC Channels: YES

Having Analog to Digital Convertor channels allows for interfacing with analog sensors and inputs.

Maximum Clock Frequency: 12 MHz

Operates at a relatively high clock frequency for faster processing speeds.

Connectivity: CAN, I2C, SPI, UART(4), USART, USB

Supports a wide range of connectivity options for versatile communication interfaces.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizing a RISC architecture, this microcontroller offers efficient and high-performance operation.

Technical Specifications

Microcontrollers CP3UB26G18NEP/NOPB attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

CR16C

Maximum Clock Frequency:

12 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

R-PQFP-G128

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

4

No. of I/O Lines:

54

No. of Terminals:

128

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Maximum Supply Current:

20 mA

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

8K

Connectivity:

CAN, I2C, SPI, UART(4), USART, USB

Peripherals:

DMA(4), POR, RTT, TIMER(6), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

CP3UB26G18NEP/NOPB Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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