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CDCR83ADBQRG4

Texas Instruments

CDCR83ADBQRG4 by Texas Instruments

CDCR83ADBQRG4 clock driver by Texas Instruments operates at 3.3V, with a max frequency of 400MHz and output characteristics in 3-STATE. It is used in industrial applications, featuring a small outline package style and dual terminal position for efficient performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 7,600 parts In-Stock

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7,600

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Vyrian

USA . 5,363 parts In-Stock

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5,363

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Digiode

USA . 1,851 parts In-Stock

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1,851

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Northwest PG Solutions

USA . 34 parts In-Stock

1+ parts

$2.974

100+ parts

-

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34

$2.974

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AZTECH Wire

Italy . 607 parts In-Stock

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$11.801

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607

$11.801

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One Stop Electronics

USA . 1,331 parts In-Stock

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$13.000

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$13.000

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Parana Technologies

USA . 1,753 parts In-Stock

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$29.998

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$65.756

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1,753

$29.998

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$65.756

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ChromeModa Solutions

Germany . 4,121 parts In-Stock

1+ parts

$33.706

100+ parts

$27.639

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4,121

$33.706

$27.639

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IDEA Electronic Components Group

UK . 1,311 parts In-Stock

1+ parts

$33.706

100+ parts

$32.021

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$30.335

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1,311

$33.706

$32.021

$30.335

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QUARKTWIN TECHNOLOGY LTD

USA . 13,238 parts In-Stock

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13,238

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A-Z Elektronik GmbH

Germany . 9,481 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,719 parts In-Stock

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4,719

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Corphita

USA . 1,827 parts In-Stock

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1,827

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Kepictronics

USA . 1,601 parts In-Stock

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Microchip USA

USA . 1,539 parts In-Stock

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1,539

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DigiPath Technology Company

USA . 1,384 parts In-Stock

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$30.389

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1,384

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$30.389

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Native Components

USA . 535 parts In-Stock

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$2.623

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535

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$2.623

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Overview

Enhancing precision and reliability in clock signal distribution, the CDCR83ADBQRG4 by Texas Instruments is a top-notch Clock Driver & Buffer designed for industrial applications. With Texas Instruments' reputation for quality and innovation, this product offers customers unmatched value and benefits. From its small outline package to its wide operating temperature range, this clock driver ensures optimal performance in various settings. Trust Texas Instruments for cutting-edge solutions that set you apart from the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the components inside, ensuring long-term reliability.

Surface Mount: YES

Enables easy and quick installation on circuit boards, saving time and effort.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with common voltage levels used in electronic devices, making it versatile for a wide range of applications.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial environments where heat generation is expected.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions, ensuring reliable performance in various environments.

Minimum Supply Voltage (Vsup): 3.135 V

Allows operation at lower voltage levels, providing flexibility in power supply options.

Minimum fmax: 400 MHz

Supports high-frequency operation, ideal for clock drivers and buffers requiring fast signal processing.

Technical Specifications

Clock Drivers & Buffers CDCR83ADBQRG4 attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

CDC

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

8.65 mm

Logic IC Type:

Maximum I (ol):

36 Amp

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Inverted Outputs:

1

No. of Terminals:

24

No. of True Outputs:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

70 mA

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

3.135 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Minimum fmax:

400 MHz

Trade Compliance

CDCR83ADBQRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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