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CDCEL937PWRG4

Texas Instruments

CDCEL937PWRG4 by Texas Instruments

CDCEL937PWRG4 by Texas Instruments is a clock generator with a max output frequency of 230MHz, operating at temperatures from -40 to 85°C. It has 20 terminals in a small outline package suitable for industrial applications requiring precise timing control. The device supports supply voltages from 1.7V to 1.9V and features CMOS technology for reliable performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 8,851 parts In-Stock

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Digiode

USA . 1,496 parts In-Stock

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Prism Electronics

USA . 26 parts In-Stock

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AZTECH Wire

Italy . 715 parts In-Stock

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$6.681

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One Stop Electronics

USA . 757 parts In-Stock

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Parana Technologies

USA . 2,371 parts In-Stock

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Corohmni

South Africa . 435 parts In-Stock

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DigiPath Technology Company

USA . 1,274 parts In-Stock

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$38.053

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$35.009

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ChromeModa Solutions

Germany . 2,404 parts In-Stock

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IDEA Electronic Components Group

UK . 1,102 parts In-Stock

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$36.888

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$34.947

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Advanced Electronics

New Zealand . 99 parts In-Stock

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Native Components

USA . 934 parts In-Stock

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Northwest PG Solutions

USA . 1,353 parts In-Stock

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Component Stockers USA

USA . 229 parts In-Stock

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Microchip USA

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Kepictronics

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Overview

Elevate your electronic designs with the Texas Instruments CDCEL937PWRG4 clock generator. Crafted with precision and expertise by a trusted manufacturer, this innovative product is essential for applications in various industries. Unlock unparalleled performance and reliability with a maximum output clock frequency of 230 MHz and a minimum supply voltage of 1.7 V. Experience seamless integration and enhanced functionality with this compact yet powerful solution. Upgrade your projects today with the Texas Instruments CDCEL937PWRG4 clock generator.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs.

Maximum Supply Voltage: 1.9 V

Operates efficiently within the specified voltage range.

Maximum Output Clock Frequency: 230 MHz

Provides high-speed clock signals for various applications.

Temperature Grade: INDUSTRIAL

Suitable for industrial environments with a wide operating temperature range.

Nominal Primary Clock/Crystal Frequency: 32 MHz

Offers a stable clock frequency for precise timing in electronic devices.

Technical Specifications

Clock Generators CDCEL937PWRG4 attributes and parameters. Explore more Clock Generators devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Clock Frequency:

230 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8

Nominal Primary Clock/Crystal Frequency:

32 MHz

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Clock Generators

Maximum Supply Voltage:

1.9 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

CDCEL937PWRG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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