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CD74HCT423M96G4

Texas Instruments

CD74HCT423M96G4 by Texas Instruments

CD74HCT423M96G4 by Texas Instruments is a Prescaler & Multivibrator with 2 functions, 102 ns propagation delay, and 5V nominal voltage. It is used in military-grade applications requiring complementary output polarity and operates within -55 to 125 °C temperature range.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,782 parts In-Stock

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6,782

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Digiode

USA . 3,479 parts In-Stock

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3,479

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Chip Stock

USA . 3,075 parts In-Stock

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3,075

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Distributors (Availability)

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AZTECH Wire

Italy . 200 parts In-Stock

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$10.682

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200

$10.682

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One Stop Electronics

USA . 1,624 parts In-Stock

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$21.000

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1,624

$21.000

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Parana Technologies

USA . 1,891 parts In-Stock

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$25.770

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$26.373

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1,891

$25.770

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$26.373

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DigiPath Technology Company

USA . 1,935 parts In-Stock

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$28.376

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$26.106

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1,935

$28.376

$26.106

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ChromeModa Solutions

Germany . 6,682 parts In-Stock

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$28.955

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$23.743

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6,682

$28.955

$23.743

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IDEA Electronic Components Group

UK . 1,770 parts In-Stock

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$28.955

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$27.507

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$26.060

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1,770

$28.955

$27.507

$26.060

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Microchip USA

USA . 1,240 parts In-Stock

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Lixinc

USA . 1,239 parts In-Stock

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Corphita

USA . 1,220 parts In-Stock

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Native Components

USA . 193 parts In-Stock

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$3.482

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Northwest PG Solutions

USA . 150 parts In-Stock

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$3.518

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$3.518

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Overview

Discover the CD74HCT423M96G4 by Texas Instruments, a high-quality Prescaler & Multivibrators component that offers reliability and performance. With Texas Instruments' reputable manufacturing standards, this product guarantees superior functionality in various applications. From communication systems to industrial equipment, the CD74HCT423M96G4 delivers exceptional value with its efficient design and versatility. Trust in Texas Instruments for cutting-edge technology that meets your needs seamlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy makes the product durable and resistant to external factors, ensuring a longer lifespan.

Surface Mount: YES

Being surface mountable allows for easier and more efficient PCB assembly process.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes it compatible with a wide range of systems and applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliability and stability even in harsh environments.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a variety of applications.

Technical Specifications

Prescaler & Multivibrators CD74HCT423M96G4 attributes and parameters. Explore more Prescaler & Multivibrators devices from Texas Instruments

Specs

Additional Features:

RETRIGGERABLE

Family:

HCT

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

2

No. of Data/Clock Inputs:

2

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay (tpd):

102 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Prescaler/Multivibrators

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

CD74HCT423M96G4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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