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CD74HCT374EE4

Texas Instruments

CD74HCT374EE4 by Texas Instruments

CD74HCT374EE4 by Texas Instruments is an 8-bit bus driver with 50 ns propagation delay at 5V. It features a 3-STATE output and positive edge trigger, suitable for military-grade applications requiring true output polarity control. With a max frequency of 20 MHz, it operates in unidirectional count direction with low enable control.

Median Price

$0.990

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 129 parts In-Stock

1+ parts

$0.260

100+ parts

$0.250

1k+ parts

$0.250

10k+ parts

-

129

$0.260

$0.250

$0.250

-

Mouser Electronics

USA . 291 parts In-Stock

1+ parts

$1.720

100+ parts

$0.803

1k+ parts

-

10k+ parts

-

291

$1.720

$0.803

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,618 parts In-Stock

1+ parts

$0.396

100+ parts

-

1k+ parts

-

10k+ parts

-

4,618

$0.396

-

-

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Vyrian

USA . 2,545 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,545

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 214 parts In-Stock

1+ parts

$0.354

100+ parts

-

1k+ parts

-

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-

214

$0.354

-

-

-

Corphita

USA . 4,295 parts In-Stock

1+ parts

$0.375

100+ parts

-

1k+ parts

-

10k+ parts

-

4,295

$0.375

-

-

-

Parana Technologies

USA . 1,150 parts In-Stock

1+ parts

$21.470

100+ parts

-

1k+ parts

$21.848

10k+ parts

-

1,150

$21.470

-

$21.848

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Native Components

USA . 302 parts In-Stock

1+ parts

$23.370

100+ parts

-

1k+ parts

-

10k+ parts

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302

$23.370

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-

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DigiPath Technology Company

USA . 1,291 parts In-Stock

1+ parts

$23.642

100+ parts

$21.750

1k+ parts

-

10k+ parts

-

1,291

$23.642

$21.750

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-

ChromeModa Solutions

Germany . 5,415 parts In-Stock

1+ parts

$24.124

100+ parts

$19.782

1k+ parts

-

10k+ parts

-

5,415

$24.124

$19.782

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IDEA Electronic Components Group

UK . 1,093 parts In-Stock

1+ parts

$24.124

100+ parts

$22.918

1k+ parts

$21.712

10k+ parts

-

1,093

$24.124

$22.918

$21.712

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Northwest PG Solutions

USA . 844 parts In-Stock

1+ parts

$25.707

100+ parts

$23.136

1k+ parts

-

10k+ parts

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844

$25.707

$23.136

-

-

Overview

Unlock the power of seamless data transmission with the Texas Instruments CD74HCT374EE4. As a leader in the industry, Texas Instruments delivers top-notch quality and reliability in every product. The CD74HCT374EE4 is a high-performance bus driver & transceiver suitable for a wide range of applications. With fast propagation delay and 3-state output characteristics, this versatile component ensures smooth data flow at a maximum frequency of 20 MHz. Trust Texas Instruments to provide you with the value and benefits you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in portable and rugged applications.

Propagation Delay At Nominal Supply: 50 ns

The low propagation delay ensures fast and efficient signal transmission, making this product suitable for high-speed data communication.

No. of Bits: 8

With 8 bits, this product can handle a wide range of data transfer requirements, providing flexibility and compatibility with various systems.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V, this product is easy to integrate into existing circuits and power supplies.

Maximum Operating Temperature: 125 °C

The wide operating temperature range allows this product to function reliably in harsh environmental conditions, making it suitable for industrial and automotive applications.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high noise immunity, making this product energy-efficient and reliable in noisy environments.

Technical Specifications

Bus Driver & Transceivers CD74HCT374EE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

HCT

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e4

Length:

25.4 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

Maximum I (ol):

6 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

50 ns

Propagation Delay (tpd):

50 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Trade Compliance

CD74HCT374EE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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