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CD74HCT240EE4

Texas Instruments

CD74HCT240EE4 by Texas Instruments

CD74HCT240EE4 by Texas Instruments is a 20-terminal bus driver with 33ns propagation delay at 5V, suitable for military-grade applications. It features 2 functions, 4 bits, and can handle up to 6A output current in a rectangular package.

Median Price

$2.160

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 447 parts In-Stock

1+ parts

$2.160

100+ parts

$1.010

1k+ parts

-

10k+ parts

-

447

$2.160

$1.010

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$0.529

100+ parts

-

1k+ parts

-

10k+ parts

-

200

$0.529

-

-

-

Digiode

USA . 3,237 parts In-Stock

1+ parts

$1.054

100+ parts

-

1k+ parts

-

10k+ parts

-

3,237

$1.054

-

-

-

Vyrian

USA . 2,980 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,980

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 2,737 parts In-Stock

1+ parts

$0.506

100+ parts

-

1k+ parts

-

10k+ parts

$0.496

2,737

$0.506

-

-

$0.496

Argo Parts USA

USA . 1,153 parts In-Stock

1+ parts

$0.506

100+ parts

-

1k+ parts

-

10k+ parts

$0.491

1,153

$0.506

-

-

$0.491

Bastille Electronics

Australia . 1,514 parts In-Stock

1+ parts

$0.529

100+ parts

$0.503

1k+ parts

$0.477

10k+ parts

$0.471

1,514

$0.529

$0.503

$0.477

$0.471

Ampacity Inc.

Singapore . 669 parts In-Stock

1+ parts

$0.940

100+ parts

-

1k+ parts

-

10k+ parts

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669

$0.940

-

-

-

Corphita

USA . 1,165 parts In-Stock

1+ parts

$0.999

100+ parts

-

1k+ parts

-

10k+ parts

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1,165

$0.999

-

-

-

AZTECH Wire

Italy . 402 parts In-Stock

1+ parts

$9.898

100+ parts

-

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10k+ parts

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402

$9.898

-

-

-

Parana Technologies

USA . 143 parts In-Stock

1+ parts

$13.726

100+ parts

$1,274.628

1k+ parts

$12.353

10k+ parts

-

143

$13.726

$1,274.628

$12.353

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DigiPath Technology Company

USA . 1,799 parts In-Stock

1+ parts

$15.114

100+ parts

-

1k+ parts

-

10k+ parts

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1,799

$15.114

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-

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IDEA Electronic Components Group

UK . 1,820 parts In-Stock

1+ parts

$15.422

100+ parts

$14.651

1k+ parts

$13.880

10k+ parts

-

1,820

$15.422

$14.651

$13.880

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ChromeModa Solutions

Germany . 146 parts In-Stock

1+ parts

$15.422

100+ parts

$12.646

1k+ parts

-

10k+ parts

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146

$15.422

$12.646

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Microchip USA

USA . 4,773 parts In-Stock

1+ parts

-

100+ parts

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4,773

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Andel Nordic

Denmark . 1,061 parts In-Stock

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1,061

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Overview

Enhance your electronic designs with the Texas Instruments CD74HCT240EE4, a high-quality bus driver and transceiver. With its advanced technology and military-grade temperature grade, this product offers reliability and precision like no other. Perfect for various applications, this component provides inverted output polarity and 3-STATE characteristics, ensuring optimal performance. Trust Texas Instruments to deliver cutting-edge solutions that exceed expectations and bring value to your projects. Upgrade your designs today with the CD74HCT240EE4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to impact, making the product suitable for rough handling and harsh environments.

Propagation Delay At Nominal Supply: 33 ns

Fast propagation delay ensures quick signal transmission, ideal for time-sensitive applications such as bus communication.

No. of Functions: 2

Multiple functions allow for versatile use and integration within different systems.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage supply ensures compatibility with common power sources.

Maximum Operating Temperature: 125 °C

High operating temperature range enables the product to function reliably in various environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the performance and efficiency of the product.

Technical Specifications

Bus Driver & Transceivers CD74HCT240EE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

TWO ACTIVE-LOW OUTPUT ENABLES

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

HCT

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e4

Length:

25.4 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

33 ns

Propagation Delay (tpd):

33 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Bus Driver/Transceiver

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

CD74HCT240EE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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