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CD74HC4066M96G4

Texas Instruments

CD74HC4066M96G4 by Texas Instruments

CD74HC4066M96G4 by Texas Instruments is a CMOS SPST switch with 4 functions, operating at temperatures from -55 to 125°C. It has a max on-state resistance of 95 ohm and nominal off-state isolation of 72 dB. Ideal for military-grade applications requiring fast switching times and low power consumption.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Chip Stock

USA . 24,200 parts In-Stock

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Digiode

USA . 2,381 parts In-Stock

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Vyrian

USA . 2,308 parts In-Stock

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Ampacity Inc.

Singapore . 445 parts In-Stock

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$0.500

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$0.500

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Native Components

USA . 682 parts In-Stock

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$0.601

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682

$0.601

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Northwest PG Solutions

USA . 1,455 parts In-Stock

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$0.661

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$0.661

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Semicontronic

India . 1,633 parts In-Stock

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$4.500

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$4.388

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$4.365

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One Stop Electronics

USA . 1,024 parts In-Stock

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$5.500

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AZTECH Wire

Italy . 513 parts In-Stock

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$17.049

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Parana Technologies

USA . 1,618 parts In-Stock

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$21.707

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$22.141

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DigiPath Technology Company

USA . 167 parts In-Stock

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$23.902

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$21.990

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ChromeModa Solutions

Germany . 426 parts In-Stock

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$24.390

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$20.000

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IDEA Electronic Components Group

UK . 213 parts In-Stock

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Component Stockers USA

USA . 502 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 26,435 parts In-Stock

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Perfect Parts

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Corphita

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Microchip USA

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Corohmni

South Africa . 251 parts In-Stock

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Overview

Upgrade your electronic projects with the CD74HC4066M96G4 by Texas Instruments, a top-quality multiplexer and switch designed to meet your needs. Manufactured by industry leader Texas Instruments, this product offers unmatched reliability and performance. With 4 functions, small outline packaging, and military-grade temperature tolerance, this versatile component is perfect for a wide range of applications. Trust in Texas Instruments for cutting-edge technology that delivers value and efficiency to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability, ensuring the product can withstand various environmental conditions.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

No. of Functions: 4

Having 4 functions in one device increases efficiency and saves space on the circuit board, making it a cost-effective choice.

Nominal Supply Voltage (Vsup): 4.5 V

Operating at a nominal supply voltage of 4.5V ensures compatibility with a wide range of systems and applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product can handle demanding operating conditions without breaking down.

Technology: CMOS

CMOS technology offers low power consumption and high reliability, making the product suitable for long-term use in various electronic devices.

Technical Specifications

Multiplexers & Switches CD74HC4066M96G4 attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

Maximum Input Voltage:

10 V

Minimum Input Voltage:

2 V

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

1

Normal Position (V):

NO

No. of Channels:

1

No. of Functions:

4

No. of Terminals:

14

Nominal Off-state Isolation:

72 dB

Nominal On-state Resistance Match:

1 ohm

Maximum On-state Resistance (Ron):

95 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/10

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Maximum Switch-off Time:

45 ns

Maximum Switch-on Time:

30 ns

Switching (V):

MAKE-BEFORE-BREAK

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

CD74HC4066M96G4 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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