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CD74HC4059EE4

Texas Instruments

CD74HC4059EE4 by Texas Instruments

CD74HC4059EE4 by Texas Instruments is a CMOS digital counter with 24 terminals and a propagation delay of 300 ns. It operates in synchronous mode, with load/preset input and positive edge trigger type. Ideal for military applications, it has a frequency of up to 18 MHz at a supply voltage range of 2-6V.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,039 parts In-Stock

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Digiode

USA . 3,098 parts In-Stock

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Nova Conductors

Japan . 81 parts In-Stock

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AZTECH Wire

Italy . 338 parts In-Stock

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$13.342

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Parana Technologies

USA . 2,377 parts In-Stock

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$23.791

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$24.424

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IDEA Electronic Components Group

UK . 2,025 parts In-Stock

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$26.731

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$25.394

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$24.058

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ChromeModa Solutions

Germany . 493 parts In-Stock

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$26.731

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$21.919

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One Stop Electronics

USA . 902 parts In-Stock

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$40.000

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Ampacity Inc.

Singapore . 381 parts In-Stock

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$44.000

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Corphita

USA . 3,430 parts In-Stock

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Argo Parts USA

USA . 2,307 parts In-Stock

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DigiPath Technology Company

USA . 2,150 parts In-Stock

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Continental Prestige Electronics

USA . 1,014 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Perfect Parts

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Overview

Elevate your digital counting experience with the CD74HC4059EE4 by Texas Instruments. Designed with precision and reliability in mind, this digital counter offers unparalleled performance in a wide range of applications. From industrial automation to consumer electronics, this product delivers exceptional value, unbeatable benefits, and unmatched advantages to customers. Trust in Texas Instruments' legacy of quality and innovation, and take your projects to the next level with the CD74HC4059EE4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Nominal Supply Voltage / Vsup (V): 4.5

The nominal supply voltage of 4.5V provides a stable power source for the digital counter to operate efficiently.

Trigger Type: POSITIVE EDGE

The positive edge trigger type ensures that the counter responds accurately to input signals, improving overall performance.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C allows the digital counter to function reliably in various environmental conditions.

Technology: CMOS

The CMOS technology used in this digital counter offers low power consumption and high noise immunity, making it energy-efficient and reliable.

Technical Specifications

Digital Counters CD74HC4059EE4 attributes and parameters. Explore more Digital Counters devices from Texas Instruments

Specs

Additional Features:

PROGRAMMABLE TO DIVIDE INPUT BY 3-15999

Count Direction:

DOWN

Family:

HC/UH

JESD-30 Code:

R-PDIP-T24

JESD-609 Code:

e4

Length:

31.75 mm

Load or Preset Input:

YES

Logic IC Type:

Maximum Frequency At Nominal Supply:

18000000 Hz

Operation Mode:

SYNCHRONOUS

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay (tpd):

300 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Prescaler/Multivibrators

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

15.24 mm

Minimum fmax:

21 MHz

Trade Compliance

CD74HC4059EE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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