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CD4555BEE4

Texas Instruments

CD4555BEE4 by Texas Instruments

CD4555BEE4 by Texas Instruments is a CMOS decoder with 4 bits and 2 functions. It has a propagation delay of 190 ns at 5V, suitable for military applications. The package style is in-line with through-hole terminals, making it ideal for high-temperature environments.

Median Price

$1.900

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 854 parts In-Stock

1+ parts

$1.900

100+ parts

$0.889

1k+ parts

$0.468

10k+ parts

-

854

$1.900

$0.889

$0.468

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,176 parts In-Stock

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6,176

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Digiode

USA . 1,948 parts In-Stock

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Inventory MP

USA . 10 parts In-Stock

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Bristol Electronics

USA . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 734 parts In-Stock

1+ parts

$12.634

100+ parts

-

1k+ parts

$13.092

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734

$12.634

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$13.092

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DigiPath Technology Company

USA . 44 parts In-Stock

1+ parts

$13.911

100+ parts

$12.798

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44

$13.911

$12.798

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ChromeModa Solutions

Germany . 3,323 parts In-Stock

1+ parts

$14.195

100+ parts

$11.640

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3,323

$14.195

$11.640

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IDEA Electronic Components Group

UK . 283 parts In-Stock

1+ parts

$14.195

100+ parts

$13.485

1k+ parts

$12.776

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283

$14.195

$13.485

$12.776

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Native Components

USA . 93 parts In-Stock

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$18.280

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93

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Northwest PG Solutions

USA . 42 parts In-Stock

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$20.108

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$18.097

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$18.097

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Corphita

USA . 4,789 parts In-Stock

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Microchip USA

USA . 4,001 parts In-Stock

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Robosynatics

Brazil . 100 parts In-Stock

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$29.303

1k+ parts

$27.135

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$27.135

100

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$29.303

$27.135

$27.135

Lucentia Tech

USA . 100 parts In-Stock

1+ parts

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$29.303

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$27.135

10k+ parts

$27.135

100

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$29.303

$27.135

$27.135

Overview

Unlock the potential of your electronics with the CD4555BEE4 by Texas Instruments. As a leader in semiconductor manufacturing, Texas Instruments delivers quality products that meet the highest standards. The CD4555BEE4 is a versatile decoder and driver chip that offers unparalleled performance and reliability. From industrial automation to consumer electronics, this product is perfect for a variety of applications. Experience the value and benefits of Texas Instruments' innovative technology with the CD4555BEE4, designed to elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ideal for various industrial applications.

Propagation Delay At Nominal Supply: 190 ns

The low propagation delay ensures fast signal processing, making this product suitable for high-speed applications.

Input Conditioning: STANDARD

Standard input conditioning simplifies integration with existing systems, reducing the need for additional configuration.

No. of Functions: 2

Having multiple functions in one device increases versatility and flexibility in design and implementation.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common 5V supply voltage makes integration easier and more compatible with other components.

Temperature Grade: MILITARY

With a military-grade temperature range, this product is designed to withstand harsh environmental conditions, ensuring reliability in critical applications.

Technical Specifications

Decoder & Drivers CD4555BEE4 attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Family:

4000/14000/40000

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Length:

19.305 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

1.5 Amp

No. of Bits:

4

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5/15

Maximum Power Supply Current (ICC):

3 mA

Propagation Delay At Nominal Supply:

190 ns

Propagation Delay (tpd):

440 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

CD4555BEE4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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