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CD4069UBM96G4

Texas Instruments

CD4069UBM96G4 by Texas Instruments

CD4069UBM96G4 by Texas Instruments is a CMOS Logic Gates IC with 6 functions, 110 ns propagation delay at 5V. It has a small outline package and operates in temperatures ranging from -55 to 125 °C. Ideal for military-grade applications requiring fast signal processing.

Median Price

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Lifecycle Status

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4

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1k+

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Chip Stock

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Vyrian

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Digiode

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Nova Conductors

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AZTECH Wire

Italy . 592 parts In-Stock

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Parana Technologies

USA . 1,195 parts In-Stock

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$23.503

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$24.133

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DigiPath Technology Company

USA . 1,848 parts In-Stock

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$25.880

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$23.809

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ChromeModa Solutions

Germany . 5,375 parts In-Stock

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$21.655

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IDEA Electronic Components Group

UK . 470 parts In-Stock

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$25.088

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Ampacity Inc.

Singapore . 343 parts In-Stock

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One Stop Electronics

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QUARKTWIN TECHNOLOGY LTD

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Microchip USA

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Overview

Elevate your electronic projects with the CD4069UBM96G4 by Texas Instruments. Known for their superior quality and reliability, Texas Instruments offers a wide range of logic gates that are perfect for a variety of applications. The CD4069UBM96G4 features fast propagation delay, small outline packaging, and dual terminal position, making it easy to integrate into your designs. With a nominal supply voltage of 5V and a maximum operating temperature of 125°C, this logic gate is suitable for military-grade applications. Trust Texas Instruments to deliver innovative solutions that meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable devices.

Propagation Delay At Nominal Supply: 110 ns

With a low propagation delay, this logic gate ensures fast and efficient signal processing in electronic circuits.

Surface Mount: YES

Being surface mountable, this product allows for easy and space-efficient PCB assembly, making it suitable for compact designs.

No. of Functions: 6

With multiple functions in a single package, this logic gate offers increased integration and reduced component count in circuit designs.

Nominal Supply Voltage / Vsup: 5V

Operating at a standard nominal voltage of 5V, this product is compatible with a wide range of electronic systems.

Load Capacitance (CL): 50 pF

The specified load capacitance ensures stable and reliable operation of the circuit by providing the required capacitive load.

Power Supplies (V): 5/15

Supporting dual power supplies of 5V and 15V, this logic gate offers versatility in system design and compatibility with different voltage levels.

No. of Terminals: 14

With 14 terminals, this product allows for easy interfacing with other components and provides flexibility in circuit connections.

Package Style (Meter): SMALL OUTLINE

The small outline package style makes this product space-efficient, suitable for applications with limited board space.

Propagation Delay (tpd): 110 ns

The specified propagation delay ensures minimal signal latency, enabling high-speed operation and precise timing in circuits.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this logic gate can withstand harsh environmental conditions and extended use.

Minimum Operating Temperature: -55 °C

Operating reliably even at low temperatures, this product is suitable for applications in cold environments or industrial settings.

Terminal Position: DUAL

The dual terminal position provides flexibility in board layout and component placement, allowing for customized circuit designs.

Maximum Seated Height: 1.75 mm

With a low maximum seated height, this product is slim and compact, making it suitable for thin electronic devices or tight spaces.

Width: 3.9 mm

The specified width of the package ensures compatibility with standard PCB layouts and allows for easy integration into electronic systems.

Minimum Supply Voltage (Vsup): 3V

With a low minimum supply voltage, this logic gate can operate efficiently in low-power applications or battery-powered devices.

Length: 8.65 mm

The specified length of the package offers compatibility with standard board dimensions and allows for easy integration into electronic assemblies.

Temperature Grade: MILITARY

Designed for military-grade applications, this product meets stringent quality and reliability standards for use in demanding environments.

Technology: CMOS

Utilizing CMOS technology, this logic gate offers low power consumption, high noise immunity, and fast operation for efficient circuit performance.

Terminal Form: GULL WING

The gull wing terminal form provides secure solder connections and ensures reliable electrical contact for stable circuit operation.

Packing Method: TR

The specified tape and reel packing method facilitates automated assembly processes, saving time and labor in production.

Terminal Pitch: 1.27 mm

With a standard terminal pitch of 1.27mm, this product allows for easy soldering and mounting on PCBs with precise alignment.

Maximum Supply Voltage (Vsup): 18V

Supporting a maximum supply voltage of 18V, this logic gate can handle higher voltage levels, making it versatile for a variety of applications.

Technical Specifications

Logic Gates CD4069UBM96G4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G14

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

110 ns

Propagation Delay (tpd):

110 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

CD4069UBM96G4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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