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CD4067BPWRE4

Texas Instruments

CD4067BPWRE4 by Texas Instruments

CD4067BPWRE4 by Texas Instruments is a 16-channel single-ended multiplexer with a max supply voltage of 18V. It operates on a nominal voltage of 5V and has a max on-state resistance of 1050 ohm. This CMOS technology-based device is ideal for military-grade applications requiring precise signal switching in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,290 parts In-Stock

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Digiode

USA . 4,254 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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One Stop Electronics

USA . 1,486 parts In-Stock

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$2.500

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Ampacity Inc.

Singapore . 239 parts In-Stock

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$4.500

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Parana Technologies

USA . 1,374 parts In-Stock

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$12.890

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$13.373

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DigiPath Technology Company

USA . 1,765 parts In-Stock

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$14.193

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$13.058

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$14.193

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ChromeModa Solutions

Germany . 5,859 parts In-Stock

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$14.483

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$11.876

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IDEA Electronic Components Group

UK . 1,356 parts In-Stock

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$14.483

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$13.759

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$13.035

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AZTECH Wire

Italy . 862 parts In-Stock

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$15.148

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Component Stockers USA

USA . 204 parts In-Stock

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$99.990

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Continental Prestige Electronics

USA . 3,772 parts In-Stock

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Corphita

USA . 3,464 parts In-Stock

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Argo Parts USA

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Bastille Electronics

Australia . 300 parts In-Stock

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Microchip USA

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Overview

Experience the superior quality and reliability of Texas Instruments with the CD4067BPWRE4 multiplexer. This versatile component offers seamless switching for up to 16 channels, making it ideal for a wide range of applications. With a compact design and high-performance capabilities, this product provides unmatched value and efficiency for your projects. Trust in Texas Instruments for cutting-edge technology that delivers exceptional results every time. Elevate your designs with the CD4067BPWRE4 and experience the difference that quality engineering can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and protection for the internal components of the multiplexer, ensuring a longer lifespan.

Surface Mount: YES

Surface mount capability allows for easy installation on printed circuit boards, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 5 V

Operating at a nominal supply voltage of 5V makes this multiplexer compatible with common power sources, increasing its versatility.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this multiplexer can withstand challenging environmental conditions without sacrificing performance.

No. of Channels: 16

Having 16 channels allows for simultaneous switching between multiple input sources, making this multiplexer suitable for complex switching applications.

Technical Specifications

Multiplexers & Switches CD4067BPWRE4 attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G24

Length:

7.8 mm

No. of Channels:

16

No. of Functions:

1

No. of Terminals:

24

Nominal On-state Resistance Match:

15 ohm

Maximum On-state Resistance (Ron):

1050 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Signal Current:

.025 A

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

3 mA

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Maximum Switch-off Time:

440 ns

Maximum Switch-on Time:

650 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

4.4 mm

Trade Compliance

CD4067BPWRE4 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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