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CD4056BME4

Texas Instruments

CD4056BME4 by Texas Instruments

CD4056BME4 by Texas Instruments is a 7-bit graphics display driver with parallel data input mode and segment display mode. It operates at supply voltages of 3-18V, suitable for military-grade applications requiring liquid crystal display drivers in small outline packages.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,537 parts In-Stock

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Digiode

USA . 2,097 parts In-Stock

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2,097

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Distributors (Availability)

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Northwest PG Solutions

USA . 901 parts In-Stock

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$2.978

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901

$2.978

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Parana Technologies

USA . 1,809 parts In-Stock

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$4.146

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$4.592

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$4.592

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ChromeModa Solutions

Germany . 4,716 parts In-Stock

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$4.658

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$3.820

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$3.820

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IDEA Electronic Components Group

UK . 1,507 parts In-Stock

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$4.658

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$4.192

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$4.658

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AZTECH Wire

Italy . 252 parts In-Stock

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$8.221

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252

$8.221

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One Stop Electronics

USA . 1,519 parts In-Stock

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$18.500

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$18.500

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Corphita

USA . 3,624 parts In-Stock

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Microchip USA

USA . 1,130 parts In-Stock

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Native Components

USA . 742 parts In-Stock

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$2.626

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742

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DigiPath Technology Company

USA . 579 parts In-Stock

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$4.200

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Overview

Elevate your display technology with the CD4056BME4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality graphics display drivers that cater to a wide range of applications. This product offers unparalleled value and benefits, providing customers with seamless functionality and reliability. Whether you're looking to enhance your segment display or improve your parallel data input mode, the CD4056BME4 is the perfect solution for all your needs. Trust Texas Instruments for cutting-edge technology that exceeds expectations every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials make the package lightweight and durable, ensuring the longevity of the product.

Display Mode: SEGMENT

Segment display mode provides clear and precise information display, making it ideal for applications where specific segments need to be highlighted.

Data Input Mode: PARALLEL

Parallel data input mode allows for fast and efficient data transfer, improving overall performance of the display driver.

Surface Mount: YES

Surface mount capability allows for easy installation and space-saving design, making it suitable for compact electronic devices.

Maximum Supply Voltage: 18 V

High maximum supply voltage ensures compatibility with a wide range of power sources, increasing flexibility in usage.

No. of Bits: 7

7-bit resolution provides sufficient detail for displaying characters or information accurately on the screen.

Power Supplies (V): 5/15

Support for both 5V and 15V power supplies offers versatility in power options, accommodating different system requirements.

No. of Terminals: 16

A higher number of terminals allow for more connections and functionalities, enhancing the capabilities of the display driver.

Minimum Supply Voltage: 3 V

Low minimum supply voltage ensures energy-efficient operation, reducing power consumption and heat generation.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability in various environmental conditions, making it suitable for industrial and military applications.

Technical Specifications

Graphics Display Drivers CD4056BME4 attributes and parameters. Explore more Graphics Display Drivers devices from Texas Instruments

Specs

Data Input Mode:

PARALLEL

Display Mode:

SEGMENT

Input Characteristics:

STANDARD

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

Multiplexed Display Capability:

NO

No. of Backplanes:

0-BP

No. of Bits:

7

No. of Channels:

1

No. of Digits/Characters:

1-DIGIT

No. of Functions:

1

No. of Segments:

7

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Other Interface ICs

Maximum Supply Current:

3 mA

Maximum Supply Voltage:

18 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

CD4056BME4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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