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CD4041UBM

Texas Instruments

CD4041UBM by Texas Instruments

CD4041UBM by Texas Instruments is a CMOS logic gate with 4 functions, 120 ns propagation delay at 5V. It operates in temperatures from -55 to 125°C and has a max supply voltage of 18V. Ideal for military-grade applications requiring fast signal processing in compact spaces.

Median Price

$0.534

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 27 parts In-Stock

1+ parts

$0.162

100+ parts

$0.159

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-

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27

$0.162

$0.159

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-

Rochester

USA . 389 parts In-Stock

1+ parts

$0.480

100+ parts

$0.470

1k+ parts

$0.460

10k+ parts

-

389

$0.480

$0.470

$0.460

-

Mouser Electronics

USA . 229 parts In-Stock

1+ parts

$1.470

100+ parts

$1.160

1k+ parts

$0.974

10k+ parts

$0.929

229

$1.470

$1.160

$0.974

$0.929

DigiKey

USA . 288 parts In-Stock

1+ parts

$1.520

100+ parts

$0.897

1k+ parts

$0.844

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-

288

$1.520

$0.897

$0.844

-

Avnet

USA . 510 parts In-Stock

1+ parts

-

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-

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$0.523

10k+ parts

$0.484

510

-

-

$0.523

$0.484

Chip1Stop

Japan . 100 parts In-Stock

1+ parts

-

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$0.546

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100

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$0.546

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Verical

USA . 27 parts In-Stock

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27

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Distributors (In-Stock)

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Digiode

USA . 1,181 parts In-Stock

1+ parts

$0.401

100+ parts

-

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1,181

$0.401

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TME

Poland . 21 parts In-Stock

1+ parts

$1.800

100+ parts

$1.090

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-

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21

$1.800

$1.090

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Vyrian

USA . 3,683 parts In-Stock

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-

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3,683

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Distributors (Availability)

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Corphita

USA . 782 parts In-Stock

1+ parts

$0.380

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782

$0.380

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Continental Prestige Electronics

USA . 85 parts In-Stock

1+ parts

$1.170

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85

$1.170

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Northwest PG Solutions

USA . 341 parts In-Stock

1+ parts

$2.689

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341

$2.689

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Microchip USA

USA . 2,395 parts In-Stock

1+ parts

$4.780

100+ parts

$4.750

1k+ parts

$4.730

10k+ parts

$4.720

2,395

$4.780

$4.750

$4.730

$4.720

Parana Technologies

USA . 147 parts In-Stock

1+ parts

$25.293

100+ parts

-

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$25.920

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147

$25.293

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$25.920

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DigiPath Technology Company

USA . 589 parts In-Stock

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$27.851

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589

$27.851

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ChromeModa Solutions

Germany . 6,403 parts In-Stock

1+ parts

$28.419

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$23.304

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6,403

$28.419

$23.304

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IDEA Electronic Components Group

UK . 400 parts In-Stock

1+ parts

$28.419

100+ parts

$26.998

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$25.577

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400

$28.419

$26.998

$25.577

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Lixinc

USA . 10,823 parts In-Stock

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Perfect Parts

USA . 7,804 parts In-Stock

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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7,000

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Native Components

USA . 934 parts In-Stock

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$2.372

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934

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$2.372

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Assy Fe

Spain . 100 parts In-Stock

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100

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Cyclops Electronics Ltd (Excess)

UK . 47 parts In-Stock

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47

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Overview

Enhance your electronic designs with the high-quality CD4041UBM logic gate by Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers reliable components for a wide range of applications. The CD4041UBM offers customers exceptional value with its fast propagation delay, versatile surface mount capabilities, and low power consumption. Whether you are working on consumer electronics, industrial automation, or aerospace systems, this compact and efficient logic gate will meet your needs. Upgrade your projects with the superior performance of the CD4041UBM from Texas Instruments.

Feature Benefit Bullets

Package Body Material : PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package durable and resistant to environmental factors, extending the product's lifespan.

Propagation Delay At Nominal Supply: 120 ns

Low propagation delay ensures fast operation and efficient processing of signals, making it suitable for real-time applications.

Surface Mount: YES

Surface mount design allows for easy installation on PCBs, saving space and reducing manufacturing costs.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage, compatible with most digital systems.

Load Capacitance (CL): 50 pF

Suitable for driving capacitive loads up to 50 pF, ensuring stable performance in various circuit configurations.

Power Supplies (V): 5/15

Supports dual power supply operation at 5V and 15V, providing flexibility in different system designs.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance in harsh environmental conditions.

Minimum Operating Temperature: -55 °C

Wide temperature range allows for operation in extreme cold environments without compromising functionality.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Logic Gates CD4041UBM attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Maximum Power Supply Current (ICC):

.12 mA

Propagation Delay At Nominal Supply:

120 ns

Propagation Delay (tpd):

120 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

CD4041UBM Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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