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CD4035BPWE4

Texas Instruments

CD4035BPWE4 by Texas Instruments

CD4035BPWE4 by Texas Instruments is a 4-bit digital shift register with a supply voltage of 5V, operating temperature range of -55 to 125°C, and max frequency of 2MHz. It is designed for military-grade applications requiring configurable output polarity and bidirectional count direction in a small outline package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,364 parts In-Stock

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Digiode

USA . 721 parts In-Stock

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721

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Distributors (Availability)

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AZTECH Wire

Italy . 368 parts In-Stock

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$7.375

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368

$7.375

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Parana Technologies

USA . 2,315 parts In-Stock

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$13.227

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$1,228.344

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$11.904

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$1,228.344

$11.904

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DigiPath Technology Company

USA . 2,278 parts In-Stock

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$14.565

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$13.400

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$14.565

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ChromeModa Solutions

Germany . 4,428 parts In-Stock

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$14.862

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$12.187

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IDEA Electronic Components Group

UK . 777 parts In-Stock

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$14.862

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$14.119

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$13.376

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777

$14.862

$14.119

$13.376

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One Stop Electronics

USA . 1,017 parts In-Stock

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$58.000

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Microchip USA

USA . 5,842 parts In-Stock

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Corphita

USA . 2,823 parts In-Stock

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Northwest PG Solutions

USA . 2,043 parts In-Stock

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$3.691

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Native Components

USA . 486 parts In-Stock

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Overview

Unlock the potential of your digital designs with the Texas Instruments CD4035BPWE4, a high-quality digital shift register that boasts unmatched reliability and performance. Manufactured by industry leader Texas Instruments, this product is ideal for a wide range of applications in various industries. With its advanced technology and superior design, this CD4035BPWE4 offers customers unparalleled value, benefits, and advantages, making it the perfect choice for all your digital shift register needs. Elevate your projects to the next level with the Texas Instruments CD4035BPWE4 - experience innovation at its finest.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight construction for the digital shift register.

No. of Bits: 4

Offers a sufficient number of bits for various digital shifting operations.

Nominal Supply Voltage / Vsup (V): 5

Operates efficiently at a standard voltage of 5V.

Propagation Delay (tpd): 500 ns

Ensures fast and reliable data shifting with a low propagation delay.

Maximum Operating Temperature: 125 °C

Capable of operating at high temperatures, suitable for various environments.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

Technical Specifications

Digital Shift Registers CD4035BPWE4 attributes and parameters. Explore more Digital Shift Registers devices from Texas Instruments

Specs

Additional Features:

J AND K BAR SERIAL INPUT

Count Direction:

BIDIRECTIONAL

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

Length:

5 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

2000000 Hz

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

CONFIGURABLE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5/15

Propagation Delay (tpd):

500 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Shift Registers

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Minimum fmax:

8 MHz

Trade Compliance

CD4035BPWE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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