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CD4017BF3AS2534

Texas Instruments

CD4017BF3AS2534 by Texas Instruments

CD4017BF3AS2534 by Texas Instruments is a 10-bit digital counter with synchronous operation. It has a propagation delay of 650 ns and operates b/w -55 to 125 °C. Ideal for military applications, this CMOS technology-based device counts up with a max fmax of 5.5 MHz.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 3,252 parts In-Stock

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Vyrian

USA . 741 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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One Stop Electronics

USA . 1,073 parts In-Stock

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$7.000

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Corohmni

South Africa . 537 parts In-Stock

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Parana Technologies

USA . 1,354 parts In-Stock

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$14.382

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$14.827

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DigiPath Technology Company

USA . 862 parts In-Stock

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$15.837

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$14.570

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AZTECH Wire

Italy . 741 parts In-Stock

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$16.074

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ChromeModa Solutions

Germany . 3,672 parts In-Stock

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IDEA Electronic Components Group

UK . 962 parts In-Stock

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$15.352

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$14.544

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Semicontronic

India . 1,354 parts In-Stock

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$39.000

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$38.025

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$37.830

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Corphita

USA . 4,199 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Continental Prestige Electronics

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Argo Parts USA

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Advanced Electronics

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Overview

Upgrade your electronic projects with the CD4017BF3AS2534 from Texas Instruments, a top-quality digital counter that offers reliability and precision. Perfect for a wide range of applications, this product is built to deliver outstanding performance in military-grade environments. With its advanced CMOS technology and synchronous operation mode, this counter ensures accurate results every time. Trust Texas Instruments for cutting-edge solutions that exceed expectations. Elevate your designs with the CD4017BF3AS2534 today!

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for internal components, ensuring a longer lifespan for the product.

No. of Bits: 10

Offers a high level of accuracy and precision in counting operations.

Nominal Supply Voltage / Vsup (V): 5

Operates efficiently with a standard voltage level, making it compatible with a wide range of applications.

Propagation Delay (tpd): 650 ns

Provides quick response time, allowing for fast counting processes.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for use in various environments.

Technology: CMOS

Uses CMOS technology which offers low power consumption and high noise immunity, enhancing overall performance.

Technical Specifications

Digital Counters CD4017BF3AS2534 attributes and parameters. Explore more Digital Counters devices from Texas Instruments

Specs

Additional Features:

LG_MAX

Count Direction:

UP

Family:

4000/14000/40000

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

21.34 mm

Load or Preset Input:

YES

Logic IC Type:

Operation Mode:

SYNCHRONOUS

No. of Bits:

10

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

650 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Counter

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Minimum fmax:

5.5 MHz

Trade Compliance

CD4017BF3AS2534 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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