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CCB3Q3306AMPWREP

Texas Instruments

CCB3Q3306AMPWREP by Texas Instruments

Texas Instruments CCB3Q3306AMPWREP is a Bus Driver & Transceiver with 2.3ns Propagation Delay, suitable for military applications. It operates at 2.5V nominal voltage, has 8 terminals in a small outline package, and supports bidirectional communication with true output polarity.

Median Price

$2.283

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 71,918 parts In-Stock

1+ parts

$2.283

100+ parts

$2.000

1k+ parts

$1.130

10k+ parts

-

71,918

$2.283

$2.000

$1.130

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,229 parts In-Stock

1+ parts

$2.169

100+ parts

-

1k+ parts

-

10k+ parts

-

4,229

$2.169

-

-

-

Vyrian

USA . 6,851 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,851

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 419 parts In-Stock

1+ parts

$1.458

100+ parts

-

1k+ parts

-

10k+ parts

-

419

$1.458

-

-

-

Northwest PG Solutions

USA . 272 parts In-Stock

1+ parts

$1.604

100+ parts

-

1k+ parts

-

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-

272

$1.604

-

-

-

Corphita

USA . 872 parts In-Stock

1+ parts

$2.055

100+ parts

-

1k+ parts

-

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872

$2.055

-

-

-

Andel Nordic

Denmark . 4,997 parts In-Stock

1+ parts

$7.202

100+ parts

-

1k+ parts

$6.914

10k+ parts

$6.914

4,997

$7.202

-

$6.914

$6.914

AZTECH Wire

Italy . 1,050 parts In-Stock

1+ parts

$13.580

100+ parts

-

1k+ parts

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1,050

$13.580

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-

-

Parana Technologies

USA . 906 parts In-Stock

1+ parts

$20.708

100+ parts

$1,923.018

1k+ parts

$18.637

10k+ parts

-

906

$20.708

$1,923.018

$18.637

-

DigiPath Technology Company

USA . 219 parts In-Stock

1+ parts

$22.802

100+ parts

-

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-

10k+ parts

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219

$22.802

-

-

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ChromeModa Solutions

Germany . 6,281 parts In-Stock

1+ parts

$23.267

100+ parts

$19.079

1k+ parts

-

10k+ parts

-

6,281

$23.267

$19.079

-

-

IDEA Electronic Components Group

UK . 1,113 parts In-Stock

1+ parts

$23.267

100+ parts

$22.104

1k+ parts

$20.940

10k+ parts

-

1,113

$23.267

$22.104

$20.940

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QUARKTWIN TECHNOLOGY LTD

USA . 19,339 parts In-Stock

1+ parts

-

100+ parts

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19,339

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Overview

Discover the CCB3Q3306AMPWREP by Texas Instruments, a high-quality bus driver & transceiver perfect for a wide range of applications. Manufactured by the renowned Texas Instruments, this product offers exceptional value and benefits to customers. With its advanced technology and reliable performance, this compact device provides fast propagation delay, true output polarity, and 3-state output characteristics. Whether you're in the military or industrial sector, this versatile component is designed to enhance your systems with efficiency and precision. Upgrade your devices today with the CCB3Q3306AMPWREP and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable for easy handling and long-lasting performance.

Propagation Delay At Nominal Supply: 2.3 ns

Low propagation delay ensures quick signal transmission, making this product ideal for high-speed data transfer applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving space and providing a clean overall design.

Nominal Supply Voltage / Vsup (V): 2.5

Operates efficiently at a low nominal supply voltage, making it energy-efficient and cost-effective in the long run.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and ensure reliable performance in various applications.

Technical Specifications

Bus Driver & Transceivers CCB3Q3306AMPWREP attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

BIDIRECTIONAL

Family:

CB3Q/3VH/3C/2B

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.4 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.7 mA

Propagation Delay At Nominal Supply:

2.3 ns

Propagation Delay (tpd):

2.3 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

3 mm

Trade Compliance

CCB3Q3306AMPWREP Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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