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CC8531RHAR

Texas Instruments

CC8531RHAR by Texas Instruments

CC8531RHAR by Texas Instruments is a telecom IC with 3.3V supply voltage, 5 Mbps data rate, and operates in industrial temperature range. It comes in a square chip carrier package with 40 terminals for surface mount applications. Ideal for telecom circuit interfaces requiring high-speed data transmission.

Median Price

$5.255

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 107,465 parts In-Stock

1+ parts

$5.255

100+ parts

$4.284

1k+ parts

$2.856

10k+ parts

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107,465

$5.255

$4.284

$2.856

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Distributors (In-Stock)

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Digiode

USA . 2,013 parts In-Stock

1+ parts

$4.992

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2,013

$4.992

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Vyrian

USA . 5,688 parts In-Stock

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5,688

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Distributors (Availability)

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Native Components

USA . 334 parts In-Stock

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$1.300

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334

$1.300

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Northwest PG Solutions

USA . 1,889 parts In-Stock

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$1.430

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1,889

$1.430

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Corphita

USA . 4,780 parts In-Stock

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$4.730

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4,780

$4.730

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Parana Technologies

USA . 2,216 parts In-Stock

1+ parts

$10.118

100+ parts

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$10.665

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2,216

$10.118

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$10.665

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AZTECH Wire

Italy . 999 parts In-Stock

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$10.990

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999

$10.990

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ChromeModa Solutions

Germany . 6,064 parts In-Stock

1+ parts

$11.369

100+ parts

$9.323

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6,064

$11.369

$9.323

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IDEA Electronic Components Group

UK . 1,129 parts In-Stock

1+ parts

$11.369

100+ parts

$10.801

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$10.232

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1,129

$11.369

$10.801

$10.232

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Lixinc

USA . 14,367 parts In-Stock

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A-Z Elektronik GmbH

Germany . 10,000 parts In-Stock

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Kepictronics

USA . 8,000 parts In-Stock

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8,000

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DigiPath Technology Company

USA . 1,983 parts In-Stock

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$10.250

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iodParts Technologies Inc.

India . 99 parts In-Stock

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Overview

Upgrade your telecom devices with the CC8531RHAR by Texas Instruments, a high-quality solution that offers unmatched reliability and performance. Manufactured by one of the industry leaders in semiconductor technology, this telecom interface IC provides seamless connectivity for a wide range of applications. With its advanced features and durable construction, this product ensures optimal functionality and efficiency. Experience the value and benefits of Texas Instruments' expertise with the CC8531RHAR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers good durability and electrical insulation, ensuring the longevity and reliability of the product.

Surface Mount: YES

Surface mount technology allows for easy and efficient integration onto circuit boards, saving space and simplifying the assembly process.

Power Supplies (V): 3.3

Operating at 3.3 volts, this product is energy efficient and suitable for a wide range of applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand challenging environmental conditions.

Data Rate: 5 Mbps

Capable of transmitting data at a rate of 5 Mbps, this product is ideal for high-speed communication applications.

Technical Specifications

Other Function Telecom Interface ICs CC8531RHAR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

5 Mbps

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6 mm

Trade Compliance

CC8531RHAR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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