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CC2541DK-RC

Texas Instruments

CC2541DK-RC by Texas Instruments

CC2541DK-RC by Texas Instruments is a Bluetooth® Smart 4.x Low Energy (BLE) transceiver operating at 2.4GHz. It is designed for use with the CC2541, offering RF Evaluation and Development capabilities. The kit includes boards and accessories in a box package, ideal for developing IoT applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,893 parts In-Stock

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Digiode

USA . 3,750 parts In-Stock

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3,750

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Distributors (Availability)

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Native Components

USA . 125 parts In-Stock

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$0.245

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$0.235

125

$0.245

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$0.235

Northwest PG Solutions

USA . 490 parts In-Stock

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$0.270

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$0.238

490

$0.270

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$0.238

AZTECH Wire

Italy . 896 parts In-Stock

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$10.088

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896

$10.088

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Semicontronic

India . 349 parts In-Stock

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$19.100

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$18.622

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$18.527

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349

$19.100

$18.622

$18.527

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One Stop Electronics

USA . 954 parts In-Stock

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$132.100

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954

$132.100

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Component Stockers USA

USA . 12 parts In-Stock

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$156.420

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12

$156.420

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Ampacity Inc.

Singapore . 235 parts In-Stock

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$215.100

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235

$215.100

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ChromeModa Solutions

Germany . 5,047 parts In-Stock

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Corphita

USA . 3,784 parts In-Stock

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3,784

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Parana Technologies

USA . 2,316 parts In-Stock

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$0.611

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2,316

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$0.611

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DigiPath Technology Company

USA . 364 parts In-Stock

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364

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Corohmni

South Africa . 103 parts In-Stock

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IDEA Electronic Components Group

UK . 17 parts In-Stock

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Perfect Parts

USA . 7 parts In-Stock

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Overview

Elevate your projects with the CC2541DK-RC from Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers top-quality products that meet the highest standards of performance and reliability. The CC2541DK-RC falls under the category of Development Boards, Kits, and Programmers, offering versatility and ease of use for various applications. With its Transceiver and Bluetooth® Smart 4.x Low Energy (BLE) capabilities, this kit is perfect for RF evaluation and development. Experience seamless connectivity and exceptional functionality with the CC2541DK-RC, providing you with the tools you need to bring your ideas to life.

Feature Benefit Bullets

Package: Box

The packaging in a box ensures safe storage and transportation of the product.

Type: Transceiver; Bluetooth® Smart 4.x Low Energy (BLE)

Being a transceiver with Bluetooth Smart technology, this product enables efficient wireless communication with low energy consumption.

Frequency: 2.4GHz

Operating at the commonly used 2.4GHz frequency, this product is compatible with a wide range of devices.

For Use With/Related Products: CC2541

Designed to work with CC2541, ensuring compatibility and seamless integration.

Supplied Contents: Board(s), Accessories

Includes essential components and accessories for quick setup and usage.

Base Product Number: CC2541

This product is based on the CC2541 platform, known for its reliability and performance.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

With an MSL of 1, this product can be exposed to various levels of moisture without impacting its functionality.

Technical Specifications

Additional Parts CC2541DK-RC attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

296-36538
CC2541DK-RC-ND

Type:

Transceiver; Bluetooth® Smart 4.x Low Energy (BLE)

Category:

Development Boards, Kits, Programmers
Evaluation Boards RF Evaluation and Development Kits, Boards

For Use With/Related Products:

CC2541

Supplied Contents:

Board(s), Accessories

Frequency:

2.4GHz

Package:

Box

Standard Package:

1

Base Product Number:

CC2541

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

CC2541DK-RC Miscellaneous Components trade compliance attributes, and parameters.

ECCN

5A992C

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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