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CC2540DK

Texas Instruments

CC2540DK by Texas Instruments

CC2540DK by Texas Instruments is a Bluetooth® Smart 4.x Low Energy (BLE) transceiver operating at 2.4GHz. It is designed for use with the CC2540, offering RF Evaluation and Development capabilities. The kit includes boards, cables, and accessories in a box package for easy development of IoT applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,667 parts In-Stock

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Digiode

USA . 387 parts In-Stock

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387

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AZTECH Wire

Italy . 418 parts In-Stock

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$8.418

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418

$8.418

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Native Components

USA . 775 parts In-Stock

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$20.740

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775

$20.740

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Northwest PG Solutions

USA . 961 parts In-Stock

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$22.814

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$20.533

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961

$22.814

$20.533

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Semicontronic

India . 399 parts In-Stock

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$24.100

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$23.498

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$23.377

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399

$24.100

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Component Stockers USA

USA . 586 parts In-Stock

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$99.990

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One Stop Electronics

USA . 832 parts In-Stock

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$141.100

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Corphita

USA . 4,475 parts In-Stock

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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IDEA Electronic Components Group

UK . 742 parts In-Stock

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Parana Technologies

USA . 367 parts In-Stock

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$1.035

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DigiPath Technology Company

USA . 298 parts In-Stock

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Corohmni

South Africa . 175 parts In-Stock

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ChromeModa Solutions

Germany . 101 parts In-Stock

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Perfect Parts

USA . 45 parts In-Stock

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Overview

Discover the endless possibilities with the Texas Instruments CC2540DK, a top-quality development kit designed for Bluetooth® Smart 4.x Low Energy applications. As a leading manufacturer in the industry, Texas Instruments guarantees reliability and innovation in every product. Unleash the power of the CC2540DK to create cutting-edge solutions in IoT, wearable devices, and more. With its easy-to-use interface and comprehensive accessories included, this kit offers unmatched value and convenience for all your wireless communication needs. Elevate your projects today with the CC2540DK from Texas Instruments.

Feature Benefit Bullets

Other Names: 296-29944, 296-29944-ND

Easy to identify and order with multiple naming options.

Category: Development Boards, Kits, Programmers, Evaluation Boards, RF Evaluation and Development Kits, Boards

Versatile board suitable for various development and evaluation projects.

Package: Box

Provides a secure and organized storage solution for the product.

Type: Transceiver; Bluetooth® Smart 4.x Low Energy (BLE)

Utilizes the latest Bluetooth technology for energy efficiency and connectivity.

Frequency: 2.4GHz

Operates on a common frequency band for widespread compatibility.

For Use With/Related Products: CC2540

Designed to work seamlessly with the specified product for enhanced performance.

Supplied Contents: Board(s), Cable(s), Accessories

Comes with essential components for immediate setup and use.

Base Product Number: CC2540

Part of a recognized product line known for quality and reliability.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

Allows for the product to be stored and used in various environments without moisture concerns.

Technical Specifications

Additional Parts CC2540DK attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

296-29944
-296-29944-ND

Type:

Transceiver; Bluetooth® Smart 4.x Low Energy (BLE)

Category:

Development Boards, Kits, Programmers
Evaluation Boards RF Evaluation and Development Kits, Boards

For Use With/Related Products:

CC2540

Supplied Contents:

Board(s), Cable(s), Accessories

Frequency:

2.4GHz

Package:

Box

Standard Package:

1

Base Product Number:

CC2540

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

CC2540DK Miscellaneous Components trade compliance attributes, and parameters.

ECCN

5A992C

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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