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BQ7693007DBT

Texas Instruments

BQ7693007DBT by Texas Instruments

BQ7693007DBT by Texas Instruments is a Power Management IC with 30 terminals in a small outline package. It operates b/w -40 to 85°C, supporting supply voltages from 6V to 25V. Ideal for power supply circuits in industrial applications due to its adjustable threshold and low supply current of 5mA.

Median Price

$4.961

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 64,581 parts In-Stock

1+ parts

$4.961

100+ parts

$4.347

1k+ parts

$2.456

10k+ parts

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64,581

$4.961

$4.347

$2.456

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Mouser Electronics

USA . 91 parts In-Stock

1+ parts

$7.070

100+ parts

$4.700

1k+ parts

$3.490

10k+ parts

$3.390

91

$7.070

$4.700

$3.490

$3.390

Rochester

USA . 22 parts In-Stock

1+ parts

-

100+ parts

$3.080

1k+ parts

$2.750

10k+ parts

$2.590

22

-

$3.080

$2.750

$2.590

Distributors (In-Stock)

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Digiode

USA . 1,627 parts In-Stock

1+ parts

$3.240

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1,627

$3.240

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Nova Conductors

Japan . 99 parts In-Stock

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$3.644

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99

$3.644

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VNN

France . 4,037 parts In-Stock

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4,037

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Vyrian

USA . 3,749 parts In-Stock

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Sensible Micro Corp

USA . 1,883 parts In-Stock

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Chip Stock

USA . 1,260 parts In-Stock

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Martec Srl

Italy . 1,260 parts In-Stock

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1,260

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Distributors (Availability)

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Ampacity Inc.

Singapore . 15,952 parts In-Stock

1+ parts

$2.900

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15,952

$2.900

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Semicontronic

India . 15,804 parts In-Stock

1+ parts

$2.900

100+ parts

$2.828

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$2.813

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15,804

$2.900

$2.828

$2.813

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Corphita

USA . 4,724 parts In-Stock

1+ parts

$3.069

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$3.069

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Continental Prestige Electronics

USA . 5,259 parts In-Stock

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$3.644

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$3.571

5,259

$3.644

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$3.571

Argo Parts USA

USA . 2,019 parts In-Stock

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$3.644

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Netroflash

USA . 100 parts In-Stock

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$3.644

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$3.644

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Parana Technologies

USA . 31 parts In-Stock

1+ parts

$4.952

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$5.492

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31

$4.952

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$5.492

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DigiPath Technology Company

USA . 445 parts In-Stock

1+ parts

$5.453

100+ parts

$5.017

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445

$5.453

$5.017

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ChromeModa Solutions

Germany . 3,622 parts In-Stock

1+ parts

$5.564

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$4.562

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3,622

$5.564

$4.562

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IDEA Electronic Components Group

UK . 1,517 parts In-Stock

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$5.564

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$5.008

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1,517

$5.564

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$5.008

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$9.047

100+ parts

$8.233

1k+ parts

$7.419

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100

$9.047

$8.233

$7.419

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Corohmni

South Africa . 628 parts In-Stock

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$22.718

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$22.718

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Infinite Electronics LLP (Excess)

. 15,416 parts In-Stock

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Authorized Procurement Solutions

USA . 10,500 parts In-Stock

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Formix International (Excess)

India . 1,922 parts In-Stock

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GreenTree Electronics

Israel . 1,260 parts In-Stock

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Lixinc

USA . 1,033 parts In-Stock

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Perfect Parts

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Overview

Enhance the efficiency and performance of your power management systems with the BQ7693007DBT by Texas Instruments. Crafted with precision and expertise, this innovative Power Management IC delivers unparalleled reliability and functionality for a wide range of applications. With its advanced features and compact design, this product offers customers value, benefits, and advantages that exceed expectations. Trust Texas Instruments to provide you with top-quality solutions that elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and insulation for the power management IC, making it suitable for various environmental conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, reducing assembly time and cost.

Package Shape: RECTANGULAR

Rectangular shape is a common and versatile design for IC packages, making it compatible with various board layouts and applications.

No. of Terminals: 30

Having 30 terminals allows for a sufficient number of connections for power management functions, providing flexibility in circuit design.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance under demanding conditions, enhancing the product's reliability.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature enables the power management IC to operate in cold environments without performance degradation.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish ensures good conductivity and corrosion resistance, prolonging the product's lifespan and reliability.

Width (mm): 4.4 mm

Compact width allows for space-efficient placement on circuit boards, especially in applications with limited board real estate.

Minimum Supply Voltage (Vsup): 6 V

Low minimum supply voltage requirement enables compatibility with a wide range of power sources, offering flexibility in system integration.

Maximum Supply Current (Isup): 5 mA

Low maximum supply current consumption helps in reducing power losses and improving energy efficiency in the overall system design.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh industrial environments, making it suitable for a wide range of applications.

Adjustable Threshold: YES

The ability to adjust the threshold voltage allows for customization based on specific application requirements, enhancing the product's versatility.

Technical Specifications

Power Management ICs BQ7693007DBT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE= 0.7V

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G30

JESD-609 Code:

e4

Length:

7.8 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

30

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Maximum Supply Current (Isup):

5 mA

Maximum Supply Voltage (Vsup):

25 V

Minimum Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+0.7V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

BQ7693007DBT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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