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BQ6400RGZT

Texas Instruments

BQ6400RGZT by Texas Instruments

BQ6400RGZT by Texas Instruments is a Power Management IC with 48 terminals, operating voltage range of 2.3V to 4.5V, and temperature grade of INDUSTRIAL. It features adjustable threshold, suitable for POWER SUPPLY MANAGEMENT CIRCUIT applications in industrial settings with a compact square package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,288 parts In-Stock

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3,288

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Digiode

USA . 2,668 parts In-Stock

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2,668

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Distributors (Availability)

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One Stop Electronics

USA . 1,045 parts In-Stock

1+ parts

$0.500

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1,045

$0.500

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Ampacity Inc.

Singapore . 458 parts In-Stock

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$5.500

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458

$5.500

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Semicontronic

India . 1,203 parts In-Stock

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$6.500

100+ parts

$6.338

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$6.305

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1,203

$6.500

$6.338

$6.305

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Parana Technologies

USA . 788 parts In-Stock

1+ parts

$7.856

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$8.413

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788

$7.856

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$8.413

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DigiPath Technology Company

USA . 536 parts In-Stock

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$8.650

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536

$8.650

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ChromeModa Solutions

Germany . 5,347 parts In-Stock

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$8.827

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$7.238

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5,347

$8.827

$7.238

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IDEA Electronic Components Group

UK . 397 parts In-Stock

1+ parts

$8.827

100+ parts

$8.386

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$7.944

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397

$8.827

$8.386

$7.944

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AZTECH Wire

Italy . 208 parts In-Stock

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$19.655

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208

$19.655

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Native Components

USA . 809 parts In-Stock

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$56.865

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$54.590

809

$56.865

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$54.590

Northwest PG Solutions

USA . 952 parts In-Stock

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$62.552

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952

$62.552

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Corphita

USA . 2,048 parts In-Stock

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2,048

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Microchip USA

USA . 1,891 parts In-Stock

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Corohmni

South Africa . 340 parts In-Stock

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340

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Overview

Elevate your power management solutions with the BQ6400RGZT by Texas Instruments. Crafted with excellence, this Power Management IC offers unparalleled quality and reliability. Designed for industrial applications, this chip carrier with a very thin profile boasts a wide supply voltage range, adjustable threshold, and four channels for maximum efficiency. Trust in Texas Instruments to deliver cutting-edge technology that ensures seamless operation and optimal performance. Upgrade your systems today with the BQ6400RGZT and experience the difference.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making the product ideal for various applications.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time and effort during installation.

Nominal Supply Voltage (Vsup): 2.7 V

Provides stable and reliable power supply to the connected devices within the specified voltage range.

No. of Terminals: 48

Offers multiple connection options, allowing for flexibility in designing and integrating the power management IC into different systems.

Maximum Operating Temperature: 85 °C

Ensures the IC can operate efficiently in a wide range of environmental conditions without overheating or performance issues.

Minimum Operating Temperature: -40 °C

Can function in extremely cold conditions, making it suitable for use in various industrial and commercial settings.

No. of Channels: 4

Enables the IC to manage power distribution for multiple devices or circuits simultaneously, increasing overall efficiency and performance.

Adjustable Threshold: YES

Allows for customization of voltage thresholds, giving users more control over power management and protection features.

Technical Specifications

Power Management ICs BQ6400RGZT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N48

Length:

7 mm

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

2.5/4

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

7 mm

Trade Compliance

BQ6400RGZT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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