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BQ298012RUGT

Texas Instruments

BQ298012RUGT by Texas Instruments

BQ298012RUGT by Texas Instruments is a Power Management IC with 8 terminals, operating b/w -40 to 85 °C. It has a supply voltage range of 1.5V to 5.5V and supports power supply circuits in industrial applications. This chip carrier package with very thin profile is surface mountable and features nickel palladium gold terminal finish.

Median Price

$1.142

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 101,670 parts In-Stock

1+ parts

$1.134

100+ parts

$0.770

1k+ parts

$0.395

10k+ parts

-

101,670

$1.134

$0.770

$0.395

-

DigiKey

USA . 605 parts In-Stock

1+ parts

$1.150

100+ parts

$0.667

1k+ parts

$0.587

10k+ parts

$0.540

605

$1.150

$0.667

$0.587

$0.540

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,879 parts In-Stock

1+ parts

$1.077

100+ parts

-

1k+ parts

-

10k+ parts

-

1,879

$1.077

-

-

-

Vyrian

USA . 3,617 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,617

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 34,034 parts In-Stock

1+ parts

$0.960

100+ parts

$0.936

1k+ parts

$0.931

10k+ parts

-

34,034

$0.960

$0.936

$0.931

-

Corphita

USA . 1,455 parts In-Stock

1+ parts

$1.021

100+ parts

-

1k+ parts

-

10k+ parts

-

1,455

$1.021

-

-

-

Corohmni

South Africa . 469 parts In-Stock

1+ parts

$1.134

100+ parts

-

1k+ parts

-

10k+ parts

-

469

$1.134

-

-

-

Parana Technologies

USA . 597 parts In-Stock

1+ parts

$2.811

100+ parts

-

1k+ parts

$3.296

10k+ parts

-

597

$2.811

-

$3.296

-

DigiPath Technology Company

USA . 1,286 parts In-Stock

1+ parts

$3.095

100+ parts

$2.847

1k+ parts

-

10k+ parts

-

1,286

$3.095

$2.847

-

-

ChromeModa Solutions

Germany . 2,068 parts In-Stock

1+ parts

$3.158

100+ parts

$2.590

1k+ parts

-

10k+ parts

-

2,068

$3.158

$2.590

-

-

IDEA Electronic Components Group

UK . 1,564 parts In-Stock

1+ parts

$3.158

100+ parts

-

1k+ parts

$2.842

10k+ parts

-

1,564

$3.158

-

$2.842

-

Native Components

USA . 990 parts In-Stock

1+ parts

$6.630

100+ parts

-

1k+ parts

-

10k+ parts

-

990

$6.630

-

-

-

Authorized Procurement Solutions

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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8,000

-

-

-

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Northwest PG Solutions

USA . 1,666 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$6.497

10k+ parts

-

1,666

-

-

$6.497

-

Overview

Elevate your power management solutions with the BQ298012RUGT by Texas Instruments. Crafted with precision and expertise, this Power Management IC offers unparalleled quality and reliability. Perfect for industrial applications, this chip carrier package delivers optimal performance in a compact design. Say goodbye to fluctuating voltages and overheating issues with the BQ298012RUGT, providing stable power supply support circuitry for your devices. Trust Texas Instruments to bring you cutting-edge technology that enhances efficiency and ensures seamless operation. Choose the BQ298012RUGT for superior power management solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the Power Management IC, making it suitable for various applications.

Surface Mount: YES

Allows for easy and secure mounting on a PCB, saving space and simplifying the assembly process.

Nominal Supply Voltage (Vsup): 3.6 V

Provides a stable supply voltage for the IC, ensuring reliable performance in different operating conditions.

Maximum Operating Temperature: 85 °C

Can withstand higher temperatures, making it suitable for industrial applications where harsh conditions are present.

Minimum Operating Temperature: -40 °C

Capable of operating in low-temperature environments, offering versatility in a range of applications.

Width (mm): 1.5 mm

Compact size allows for easy integration into tight spaces, ideal for small form factor designs.

Nominal Threshold Voltage (V): 2.75

Precise threshold voltage helps in accurately regulating power, ensuring stable operation of the connected devices.

Temperature Grade: INDUSTRIAL

Designed to meet industrial standards for temperature tolerance, making it suitable for demanding industrial environments.

Maximum Supply Current (Isup): 0.008 mA

Low supply current consumption results in energy efficiency, reducing power consumption in the system.

Maximum Supply Voltage (Vsup): 5.5 V

Wide supply voltage range allows for compatibility with a variety of systems, offering flexibility in usage.

Technical Specifications

Power Management ICs BQ298012RUGT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PQCC-N8

JESD-609 Code:

e4

Length:

1.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC8,.06SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.4 mm

Maximum Supply Current (Isup):

.008 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Nominal Threshold Voltage (V):

2.75

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.5 mm

Trade Compliance

BQ298012RUGT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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