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BQ294707DSGT

Texas Instruments

BQ294707DSGT by Texas Instruments

BQ294707DSGT by Texas Instruments is a Power Management IC with 8 terminals, operating voltage range of 3-20V, and temperature range of -40 to 110°C. It is designed for industrial applications requiring power supply support circuits in a small outline package suitable for surface mounting.

Median Price

$1.042

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 500 parts In-Stock

1+ parts

$0.320

100+ parts

$0.310

1k+ parts

$0.310

10k+ parts

-

500

$0.320

$0.310

$0.310

-

Texas Instruments

USA . 2,750 parts In-Stock

1+ parts

$1.042

100+ parts

$0.708

1k+ parts

$0.363

10k+ parts

-

2,750

$1.042

$0.708

$0.363

-

DigiKey

USA . 750 parts In-Stock

1+ parts

$1.130

100+ parts

$0.654

1k+ parts

$0.575

10k+ parts

$0.529

750

$1.130

$0.654

$0.575

$0.529

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,964 parts In-Stock

1+ parts

$0.990

100+ parts

-

1k+ parts

-

10k+ parts

-

3,964

$0.990

-

-

-

TME

Poland . 244 parts In-Stock

1+ parts

$1.520

100+ parts

$0.970

1k+ parts

$0.800

10k+ parts

-

244

$1.520

$0.970

$0.800

-

Vyrian

USA . 2,258 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,258

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 781 parts In-Stock

1+ parts

$0.938

100+ parts

-

1k+ parts

-

10k+ parts

-

781

$0.938

-

-

-

Parana Technologies

USA . 247 parts In-Stock

1+ parts

$16.002

100+ parts

-

1k+ parts

$16.345

10k+ parts

-

247

$16.002

-

$16.345

-

DigiPath Technology Company

USA . 1,125 parts In-Stock

1+ parts

$17.620

100+ parts

$16.211

1k+ parts

-

10k+ parts

-

1,125

$17.620

$16.211

-

-

ChromeModa Solutions

Germany . 2,083 parts In-Stock

1+ parts

$17.980

100+ parts

$14.744

1k+ parts

-

10k+ parts

-

2,083

$17.980

$14.744

-

-

IDEA Electronic Components Group

UK . 318 parts In-Stock

1+ parts

$17.980

100+ parts

$17.081

1k+ parts

$16.182

10k+ parts

-

318

$17.980

$17.081

$16.182

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Perfect Parts

USA . 4,589 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,589

-

-

-

-

Northwest PG Solutions

USA . 1,237 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,237

-

-

-

-

Native Components

USA . 418 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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418

-

-

-

-

Overview

Experience unparalleled power management with the BQ294707DSGT by Texas Instruments. Crafted with precision and excellence, this Power Management IC offers a wide range of applications, ensuring optimal performance in various scenarios. With Texas Instruments' reputation for quality and innovation, you can trust that this product will exceed your expectations. Whether you're looking to enhance efficiency or streamline operations, the BQ294707DSGT provides unmatched value, benefits, and advantages to meet your needs. Elevate your power management capabilities today with this cutting-edge solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures good durability and reliability of the product.

Surface Mount: YES

The surface mount feature allows for easy and efficient PCB assembly.

Power Supplies (V): 3/20

Support for a wide range of power supply voltages (3V to 20V) makes this product versatile and suitable for various applications.

No. of Terminals: 8

Having 8 terminals provides ample connectivity options for different components in the circuit.

Maximum Operating Temperature: 110 °C

The high maximum operating temperature of 110°C ensures stable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C makes this product suitable for use in cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, enhancing the product's overall performance.

Width (mm): 2 mm

The compact width of 2mm makes this product suitable for space-constrained applications.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for high-density mounting, saving PCB space.

Technical Specifications

Power Management ICs BQ294707DSGT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

Battery over-voltage protection(Min/Max)(V) : 3.85 and 4.6

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e4

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

8

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.08,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/20

Qualification:

Not Qualified

Maximum Seated Height:

.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.002 mA

Maximum Supply Voltage (Vsup):

20 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2 mm

Trade Compliance

BQ294707DSGT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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