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BQ2944L9DRBT

Texas Instruments

BQ2944L9DRBT by Texas Instruments

BQ2944L9DRBT by Texas Instruments is a Power Management IC with 8 terminals, operating voltage range of 4-25V, and temperature range of -40 to 110°C. It is designed for industrial applications requiring power supply support circuits in a small outline package with surface mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,279 parts In-Stock

1+ parts

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8,279

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Digiode

USA . 3,518 parts In-Stock

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3,518

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Distributors (Availability)

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Native Components

USA . 701 parts In-Stock

1+ parts

$0.303

100+ parts

-

1k+ parts

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10k+ parts

$0.291

701

$0.303

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-

$0.291

Northwest PG Solutions

USA . 2,262 parts In-Stock

1+ parts

$0.333

100+ parts

-

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$0.294

2,262

$0.333

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-

$0.294

Semicontronic

India . 1,475 parts In-Stock

1+ parts

$1.500

100+ parts

$1.462

1k+ parts

$1.455

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1,475

$1.500

$1.462

$1.455

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One Stop Electronics

USA . 1,382 parts In-Stock

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$3.500

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1,382

$3.500

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Ampacity Inc.

Singapore . 833 parts In-Stock

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$4.500

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833

$4.500

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Parana Technologies

USA . 996 parts In-Stock

1+ parts

$13.239

100+ parts

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$13.743

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996

$13.239

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$13.743

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DigiPath Technology Company

USA . 2,344 parts In-Stock

1+ parts

$14.578

100+ parts

$13.411

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2,344

$14.578

$13.411

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ChromeModa Solutions

Germany . 657 parts In-Stock

1+ parts

$14.875

100+ parts

$12.198

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657

$14.875

$12.198

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IDEA Electronic Components Group

UK . 122 parts In-Stock

1+ parts

$14.875

100+ parts

$14.131

1k+ parts

$13.388

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122

$14.875

$14.131

$13.388

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AZTECH Wire

Italy . 676 parts In-Stock

1+ parts

$16.932

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676

$16.932

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Corohmni

South Africa . 497 parts In-Stock

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497

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Microchip USA

USA . 150 parts In-Stock

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150

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Corphita

USA . 91 parts In-Stock

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91

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Overview

Elevate your power management solutions with the BQ2944L9DRBT by Texas Instruments. Crafted with precision and expertise, this Power Management IC offers unparalleled quality and reliability. Ideal for a wide range of applications, this product boasts a compact package design and wide operating temperature range, ensuring optimal performance in any environment. Experience the value and benefits of Texas Instruments' commitment to excellence with the BQ2944L9DRBT, providing customers with efficient power supply support and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components of the IC, enhancing its durability and reliability.

Surface Mount: YES

Allows for easy and convenient mounting on circuit boards, saving space and making the overall design more compact.

Nominal Supply Voltage (Vsup): 17 V

Optimal supply voltage for efficient power management, ensuring stable and consistent performance.

No. of Terminals: 8

Provides versatility in connectivity options, allowing for various connections to external components or devices.

Maximum Operating Temperature: 110 °C

Can operate efficiently in high-temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Can operate in low-temperature conditions, adding to its versatility and reliability in different operating environments.

Maximum Seated Height: 1 mm

Low profile design enables the IC to be used in compact devices and applications with space constraints.

Temperature Grade: INDUSTRIAL

Designed to meet industrial temperature requirements, ensuring reliable performance in harsh operating conditions.

Technical Specifications

Power Management ICs BQ2944L9DRBT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-N8

Length:

3 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.12,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

4/25

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0035 mA

Maximum Supply Voltage (Vsup):

25 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage (Vsup):

17 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3 mm

Trade Compliance

BQ2944L9DRBT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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