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BQ24751BRHDTG4

Texas Instruments

BQ24751BRHDTG4 by Texas Instruments

BQ24751BRHDTG4 by Texas Instruments is a Power Management IC with 28 terminals in a square package. It operates b/w -40 to 125°C, supporting supply voltages from 5V to 24V. This chip carrier is ideal for automotive applications due to its buck switcher configuration and adjustable threshold feature.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,328 parts In-Stock

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Digiode

USA . 3,244 parts In-Stock

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3,244

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Distributors (Availability)

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One Stop Electronics

USA . 1,314 parts In-Stock

1+ parts

$0.500

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-

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1,314

$0.500

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Ampacity Inc.

Singapore . 1,555 parts In-Stock

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$2.500

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-

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1,555

$2.500

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Semicontronic

India . 471 parts In-Stock

1+ parts

$2.500

100+ parts

$2.438

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$2.425

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-

471

$2.500

$2.438

$2.425

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Parana Technologies

USA . 1,834 parts In-Stock

1+ parts

$2.989

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-

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$3.493

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1,834

$2.989

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$3.493

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DigiPath Technology Company

USA . 974 parts In-Stock

1+ parts

$3.291

100+ parts

$3.028

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974

$3.291

$3.028

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ChromeModa Solutions

Germany . 2,672 parts In-Stock

1+ parts

$3.358

100+ parts

$2.754

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2,672

$3.358

$2.754

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IDEA Electronic Components Group

UK . 513 parts In-Stock

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$3.358

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$3.022

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513

$3.358

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$3.022

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AZTECH Wire

Italy . 380 parts In-Stock

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$6.267

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380

$6.267

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QUARKTWIN TECHNOLOGY LTD

USA . 27,008 parts In-Stock

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Northwest PG Solutions

USA . 2,327 parts In-Stock

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Corphita

USA . 1,923 parts In-Stock

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Microchip USA

USA . 1,601 parts In-Stock

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Native Components

USA . 623 parts In-Stock

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Corohmni

South Africa . 150 parts In-Stock

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150

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Overview

Experience high-quality power management with the BQ24751BRHDTG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch reliability and performance. This Power Management IC is perfect for a wide range of applications, offering customers unparalleled value and benefits. With its advanced features and innovative design, this product provides customers with the advantage they need to stay ahead in today's competitive market. Choose the BQ24751BRHDTG4 for superior power management solutions that deliver results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good thermal and electrical insulation, making the product durable and reliable.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs, saving space and reducing production costs.

Package Shape: SQUARE

Square shape helps in efficient utilization of space on the PCB, especially in compact designs.

No. of Terminals: 28

Having 28 terminals allows for multiple connections and functionalities within the power management IC.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability and stability under various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures enables the product to function in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish provides good conductivity and corrosion resistance, ensuring a long lifespan for the IC.

Terminal Position: QUAD

Quad terminal position allows for easy connection and integration with other components on the PCB.

Width (mm): 5 mm

Compact width of 5mm enables the IC to be used in space-constrained applications.

Minimum Supply Voltage (Vsup): 5 V

Low minimum supply voltage allows for efficient power management even with low input voltages.

Temperature Grade: AUTOMOTIVE

Automotive grade ensures high reliability and performance in automotive applications, meeting industry standards.

Switcher Config: BUCK

BUCK configuration allows for efficient step-down voltage regulation, making the product suitable for various power management applications.

Technical Specifications

Power Management ICs BQ24751BRHDTG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N28

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

24 V

Minimum Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Switcher Config:

BUCK

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5 mm

Trade Compliance

BQ24751BRHDTG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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