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BQ24751BRHDRG4

Texas Instruments

BQ24751BRHDRG4 by Texas Instruments

BQ24751BRHDRG4 by Texas Instruments is a Power Management IC with 28 terminals, operating voltage range of 7-24V, and temperature grade suitable for automotive applications. It features adjustable threshold, nickel palladium gold finish, and compact chip carrier package ideal for power supply support circuits in automotive electronics.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,675 parts In-Stock

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7,675

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Digiode

USA . 3,092 parts In-Stock

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3,092

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Distributors (Availability)

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Ampacity Inc.

Singapore . 220 parts In-Stock

1+ parts

$3.500

100+ parts

-

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220

$3.500

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One Stop Electronics

USA . 345 parts In-Stock

1+ parts

$4.500

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-

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345

$4.500

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Semicontronic

India . 810 parts In-Stock

1+ parts

$6.500

100+ parts

$6.338

1k+ parts

$6.305

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810

$6.500

$6.338

$6.305

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AZTECH Wire

Italy . 351 parts In-Stock

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$8.357

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351

$8.357

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Parana Technologies

USA . 764 parts In-Stock

1+ parts

$10.158

100+ parts

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$10.697

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764

$10.158

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$10.697

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DigiPath Technology Company

USA . 1,362 parts In-Stock

1+ parts

$11.185

100+ parts

$10.290

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1,362

$11.185

$10.290

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IDEA Electronic Components Group

UK . 932 parts In-Stock

1+ parts

$11.413

100+ parts

$10.842

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$10.272

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932

$11.413

$10.842

$10.272

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ChromeModa Solutions

Germany . 578 parts In-Stock

1+ parts

$11.413

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$9.359

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578

$11.413

$9.359

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Component Stockers USA

USA . 744 parts In-Stock

1+ parts

$99.990

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744

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 25,938 parts In-Stock

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25,938

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Corphita

USA . 4,454 parts In-Stock

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4,454

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Microchip USA

USA . 937 parts In-Stock

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937

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Northwest PG Solutions

USA . 575 parts In-Stock

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575

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Native Components

USA . 558 parts In-Stock

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558

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Corohmni

South Africa . 352 parts In-Stock

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352

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Overview

Looking for a reliable power management solution? Look no further than the BQ24751BRHDRG4 by Texas Instruments. With a reputation for high-quality products, Texas Instruments delivers excellence in the Power Management ICs category. This versatile chip carrier with a very thin profile is perfect for a wide range of applications. From automotive to industrial, this power supply support circuit offers unmatched value and performance. Trust Texas Instruments to provide the best-in-class solutions for your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components of the Power Management IC, making it durable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation onto circuit boards, saving time and effort in the assembly process.

Power Supplies (V): 7/24

This Power Management IC can support a wide range of power supplies from 7V to 24V, making it versatile for different voltage requirements.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The various package styles provide flexibility in design and application, allowing for efficient heat dissipation and space-saving in electronic devices.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliability and stability in harsh environments or under heavy loads.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for use in cold environments without compromising performance.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent conductivity, corrosion resistance, and solderability, ensuring a reliable connection and longevity of the Power Management IC.

Width (mm): 5 mm

The compact width of the IC enables efficient use of space on the circuit board, ideal for compact electronic devices.

Minimum Supply Voltage (Vsup): 5 V

The low minimum supply voltage allows for compatibility with a wide range of power sources, providing flexibility in system design.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade indicates that this Power Management IC is designed to withstand the demanding temperature conditions of automotive environments with high reliability.

Technical Specifications

Power Management ICs BQ24751BRHDRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N28

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

7/24

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Voltage (Vsup):

24 V

Minimum Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5 mm

Trade Compliance

BQ24751BRHDRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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