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BQ24721CRHBTG4

Texas Instruments

BQ24721CRHBTG4 by Texas Instruments

BQ24721CRHBTG4 by Texas Instruments is a Power Management IC with 32 terminals, operating from -40 to 85°C. It features a BUCK switcher config, suitable for industrial applications with Vsup ranging from 8V to 24V. The chip carrier package style has a very thin profile and nickel/palladium/gold terminal finish.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,356 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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6,356

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Digiode

USA . 940 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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940

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 300 parts In-Stock

1+ parts

$3.500

100+ parts

$3.412

1k+ parts

$3.395

10k+ parts

-

300

$3.500

$3.412

$3.395

-

Parana Technologies

USA . 13 parts In-Stock

1+ parts

$5.207

100+ parts

-

1k+ parts

$5.818

10k+ parts

-

13

$5.207

-

$5.818

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AZTECH Wire

Italy . 703 parts In-Stock

1+ parts

$5.217

100+ parts

-

1k+ parts

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703

$5.217

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-

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Ampacity Inc.

Singapore . 250 parts In-Stock

1+ parts

$5.500

100+ parts

-

1k+ parts

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10k+ parts

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250

$5.500

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-

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DigiPath Technology Company

USA . 553 parts In-Stock

1+ parts

$5.734

100+ parts

-

1k+ parts

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10k+ parts

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553

$5.734

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-

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ChromeModa Solutions

Germany . 3,170 parts In-Stock

1+ parts

$5.851

100+ parts

$4.798

1k+ parts

-

10k+ parts

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3,170

$5.851

$4.798

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-

IDEA Electronic Components Group

UK . 652 parts In-Stock

1+ parts

$5.851

100+ parts

-

1k+ parts

$5.266

10k+ parts

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652

$5.851

-

$5.266

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One Stop Electronics

USA . 473 parts In-Stock

1+ parts

$7.500

100+ parts

-

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473

$7.500

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Native Components

USA . 730 parts In-Stock

1+ parts

$15.149

100+ parts

-

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730

$15.149

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Northwest PG Solutions

USA . 578 parts In-Stock

1+ parts

$16.664

100+ parts

$14.998

1k+ parts

-

10k+ parts

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578

$16.664

$14.998

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Corphita

USA . 2,113 parts In-Stock

1+ parts

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2,113

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Microchip USA

USA . 2,015 parts In-Stock

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2,015

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Corohmni

South Africa . 80 parts In-Stock

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80

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Overview

Unlock the power of efficient and reliable power management with the BQ24721CRHBTG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Power Management ICs that cater to a wide range of applications. With a focus on innovation and performance, this product offers customers unparalleled value, benefits, and advantages. Experience seamless power supply management with this compact and versatile chip carrier, heat sink/slug, very thin profile package style. Trust Texas Instruments to deliver excellence in every detail, from the nickel/palladium/gold terminal finish to the industrial-grade temperature tolerance. Elevate your power management solutions with the BQ24721CRHBTG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection for the IC and is cost-effective.

Surface Mount: YES

Offers easy and efficient mounting on PCBs.

Package Shape: SQUARE

Helps in saving space on the PCB.

No. of Terminals: 32

Allows for connections to various components in the system.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Ensures efficient heat dissipation and compact design.

Maximum Operating Temperature: 85 °C

Suitable for various industrial applications.

Minimum Operating Temperature: -40 °C

Wide temperature range for operation in different environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Provides good conductivity and corrosion resistance.

Terminal Position: QUAD

Facilitates easy connections in a quad arrangement.

Maximum Seated Height: 1 mm

Low profile for space-constrained applications.

Width (mm): 5 mm

Compact size for integration in tight spaces.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

Specifically designed for power management applications.

Minimum Supply Voltage (Vsup): 8 V

Wide input voltage range for compatibility with different systems.

Peak Reflow Temperature °C: 260

Can withstand high-temperature reflow soldering processes.

Length: 5 mm

Compact size for space-saving PCB design.

Temperature Grade: INDUSTRIAL

Suitable for harsh industrial environments.

Terminal Form: NO LEAD

Lead-free terminal for environmental compliance.

Switcher Config: BUCK

Efficient buck converter for power management.

Terminal Pitch: 0.5 mm

Fine pitch for high-density PCB layout.

Moisture Sensitivity Level (MSL): 2

Moderate moisture sensitivity for reliable performance.

Maximum Supply Voltage (Vsup): 24 V

Supports a high input voltage range for flexibility in applications.

Technical Specifications

Power Management ICs BQ24721CRHBTG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

24 V

Minimum Supply Voltage (Vsup):

8 V

Surface Mount:

YES

Switcher Config:

BUCK

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

5 mm

Trade Compliance

BQ24721CRHBTG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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