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BQ24400PWRG4

Texas Instruments

BQ24400PWRG4 by Texas Instruments

BQ24400PWRG4 by Texas Instruments is a Power Management IC with 8 terminals, operating voltage of 4-6V, and adjustable threshold. It is used in power supply support circuits, has a small outline package style, and can operate b/w -20 to 70°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 3,728 parts In-Stock

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Vyrian

USA . 3,179 parts In-Stock

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Ampacity Inc.

Singapore . 126 parts In-Stock

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$1.500

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One Stop Electronics

USA . 1,586 parts In-Stock

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$4.500

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$4.500

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Semicontronic

India . 836 parts In-Stock

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$4.500

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$4.388

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$4.365

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836

$4.500

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Parana Technologies

USA . 536 parts In-Stock

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$6.876

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$7.494

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536

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IDEA Electronic Components Group

UK . 731 parts In-Stock

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$7.726

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$6.953

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731

$7.726

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ChromeModa Solutions

Germany . 369 parts In-Stock

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$7.726

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$6.335

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AZTECH Wire

Italy . 581 parts In-Stock

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$18.344

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Microchip USA

USA . 3,440 parts In-Stock

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Corphita

USA . 2,427 parts In-Stock

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Northwest PG Solutions

USA . 1,145 parts In-Stock

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Native Components

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DigiPath Technology Company

USA . 468 parts In-Stock

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Corohmni

South Africa . 433 parts In-Stock

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Overview

Enhance your power management systems with the BQ24400PWRG4 by Texas Instruments. Crafted with precision and excellence, this Power Management IC offers unparalleled reliability and efficiency. Perfect for a wide range of applications, this high-quality product ensures optimal performance and longevity. With its advanced features and user-friendly design, the BQ24400PWRG4 provides exceptional value and benefits to customers seeking top-notch power management solutions. Upgrade your systems today with Texas Instruments' cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product cost-effective and lightweight.

Surface Mount: YES

Being surface mountable, this product is easy to install, saves space, and enables automated assembly processes.

Nominal Supply Voltage (Vsup): 5 V

The nominal supply voltage of 5V ensures compatibility with a wide range of applications and devices.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style helps in reducing the overall size of the product and enhances portability.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand high temperature environments effectively.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish ensures reliable electrical connections and corrosion resistance.

Width (mm): 3 mm

The narrow width of 3mm makes the product suitable for applications where space constraints are a concern.

Minimum Supply Voltage (Vsup): 4 V

The minimum supply voltage of 4V allows for operation even in scenarios where power input may fluctuate or drop slightly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures robust soldering and reliability during the manufacturing process.

Maximum Supply Current (Isup): 1 mA

With a low maximum supply current of 1mA, this product offers energy efficiency in power management applications.

Technical Specifications

Power Management ICs BQ24400PWRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.4 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

1 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

BQ24400PWRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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