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BQ24271RGET

Texas Instruments

BQ24271RGET by Texas Instruments

BQ24271RGET by Texas Instruments is a Power Management IC with 24 terminals in a square package. It operates b/w -40 to 85°C, suitable for industrial use. With a buck switcher configuration and terminal finish of Ni/Pd/Au, it's ideal for power supply management circuits.

Median Price

$9.678

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,000 parts In-Stock

1+ parts

$8.037

100+ parts

$6.552

1k+ parts

$4.368

10k+ parts

-

2,000

$8.037

$6.552

$4.368

-

DigiKey

USA . 132 parts In-Stock

1+ parts

$11.320

100+ parts

$7.579

1k+ parts

$6.968

10k+ parts

$6.861

132

$11.320

$7.579

$6.968

$6.861

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 238 parts In-Stock

1+ parts

$7.635

100+ parts

-

1k+ parts

-

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238

$7.635

-

-

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Vyrian

USA . 8,242 parts In-Stock

1+ parts

-

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-

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8,242

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-

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Ashlea Components Ltd

UK . 81 parts In-Stock

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81

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ACDS - Activité Composants Distribution Service

France . 15 parts In-Stock

1+ parts

-

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15

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 719 parts In-Stock

1+ parts

$6.830

100+ parts

-

1k+ parts

-

10k+ parts

-

719

$6.830

-

-

-

Corphita

USA . 580 parts In-Stock

1+ parts

$7.233

100+ parts

-

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580

$7.233

-

-

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Native Components

USA . 112 parts In-Stock

1+ parts

$16.470

100+ parts

-

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112

$16.470

-

-

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Northwest PG Solutions

USA . 783 parts In-Stock

1+ parts

$18.117

100+ parts

$16.305

1k+ parts

-

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783

$18.117

$16.305

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-

Parana Technologies

USA . 577 parts In-Stock

1+ parts

$20.267

100+ parts

-

1k+ parts

$20.260

10k+ parts

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577

$20.267

-

$20.260

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DigiPath Technology Company

USA . 914 parts In-Stock

1+ parts

$22.317

100+ parts

$20.531

1k+ parts

-

10k+ parts

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914

$22.317

$20.531

-

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ChromeModa Solutions

Germany . 1,444 parts In-Stock

1+ parts

$22.772

100+ parts

$18.673

1k+ parts

-

10k+ parts

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1,444

$22.772

$18.673

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IDEA Electronic Components Group

UK . 510 parts In-Stock

1+ parts

$22.772

100+ parts

$21.633

1k+ parts

$20.495

10k+ parts

-

510

$22.772

$21.633

$20.495

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Kepictronics

USA . 500 parts In-Stock

1+ parts

-

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500

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A-Z Elektronik GmbH

Germany . 500 parts In-Stock

1+ parts

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500

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Cyclops Electronics Ltd (Excess)

UK . 35 parts In-Stock

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35

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Overview

Unlock the power of efficient and reliable power management with the BQ24271RGET by Texas Instruments. With a reputation for quality and innovation, Texas Instruments delivers cutting-edge solutions in the Power Management ICs category. This versatile chip carrier with a very thin profile offers a wide range of applications, ensuring high performance and durability in various industrial settings. Experience the benefits of superior design and functionality with the BQ24271RGET, providing customers with value and peace of mind in their power supply management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good insulation and protection for the internal components of the IC, ensuring reliability and durability.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and reducing assembly costs.

No. of Terminals: 24

Having 24 terminals allows for a wide range of input and output connections, offering flexibility in design and functionality.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this IC can perform reliably in various environmental conditions.

Minimum Operating Temperature: -40 °C

The IC can operate at low temperatures as low as -40°C, making it suitable for outdoor or industrial applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel/palladium/gold terminal finish ensures good conductivity, corrosion resistance, and long-term reliability.

Switcher Config: BUCK

The buck switcher configuration allows for efficient step-down voltage conversion, making the IC suitable for power management applications.

Technical Specifications

Power Management ICs BQ24271RGET attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

4.2 V

Surface Mount:

YES

Switcher Config:

BUCK

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

4 mm

Trade Compliance

BQ24271RGET Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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