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BQ24262YFFR

Texas Instruments

BQ24262YFFR by Texas Instruments

BQ24262YFFR by Texas Instruments is a Power Management IC with 36 terminals in a rectangular package. It operates b/w -40 to 85°C, supporting supply voltages from 4.2V to 28V. With a very thin profile and fine pitch, it's ideal for industrial power supply applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Cyclops Electronics Ltd

UK . 65,590 parts In-Stock

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65,590

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Vyrian

USA . 7,967 parts In-Stock

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7,967

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Digiode

USA . 1,830 parts In-Stock

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1,830

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Distributors (Availability)

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Native Components

USA . 183 parts In-Stock

1+ parts

$0.397

100+ parts

-

1k+ parts

-

10k+ parts

$0.381

183

$0.397

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$0.381

Northwest PG Solutions

USA . 541 parts In-Stock

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$0.436

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-

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$0.385

541

$0.436

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$0.385

One Stop Electronics

USA . 625 parts In-Stock

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$4.500

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625

$4.500

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Parana Technologies

USA . 970 parts In-Stock

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$15.093

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$15.503

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970

$15.093

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$15.503

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DigiPath Technology Company

USA . 1,697 parts In-Stock

1+ parts

$16.619

100+ parts

$15.289

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1,697

$16.619

$15.289

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ChromeModa Solutions

Germany . 4,521 parts In-Stock

1+ parts

$16.958

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$13.906

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$16.958

$13.906

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IDEA Electronic Components Group

UK . 1,733 parts In-Stock

1+ parts

$16.958

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$16.110

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$15.262

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1,733

$16.958

$16.110

$15.262

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AZTECH Wire

Italy . 847 parts In-Stock

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$19.481

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Microchip USA

USA . 7,540 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 7,417 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,960 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,973 parts In-Stock

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Kepictronics

USA . 2,454 parts In-Stock

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2,454

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Corphita

USA . 898 parts In-Stock

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Robosynatics

Brazil . 250 parts In-Stock

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250

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Lucentia Tech

USA . 250 parts In-Stock

1+ parts

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100+ parts

$4.039

1k+ parts

$3.740

10k+ parts

$3.740

250

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$4.039

$3.740

$3.740

Overview

Experience top-quality power management with the BQ24262YFFR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers innovative solutions that cater to a wide range of applications. The BQ24262YFFR offers unparalleled value, providing customers with reliable performance, efficiency, and precision. Say goodbye to power interruptions and hello to seamless operations with this cutting-edge Power Management IC. Unlock the full potential of your devices with the BQ24262YFFR from Texas Instruments.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient installation onto PCBs, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 5 V

Provides a stable and standard voltage supply, ensuring reliable performance.

No. of Terminals: 36

Offers a sufficient number of connection points for various components and peripherals.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial environments with heat exposure.

Terminal Finish: TIN SILVER COPPER

Provides excellent conductivity and corrosion resistance for reliable connections and longevity.

Width (mm): 2.455 mm

Compact size for efficient use of PCB space and layout.

Minimum Supply Voltage (Vsup): 4.2 V

Ensures functionality even at lower voltage levels, increasing flexibility in power source options.

Terminal Form: BALL

Enables easy rework or replacement of the IC if needed.

Maximum Supply Voltage (Vsup): 28 V

Can handle higher voltage inputs, expanding compatibility with different power sources.

Adjustable Threshold: YES

Allows for customization of voltage thresholds to suit specific application requirements.

Technical Specifications

Power Management ICs BQ24262YFFR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

RECHARGE THRESHOLD VOLTAGE IS 0.12V

Adjustable Threshold:

YES

JESD-30 Code:

R-XBGA-B36

JESD-609 Code:

e1

Length:

2.455 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.625 mm

Maximum Supply Voltage (Vsup):

28 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Nominal Threshold Voltage (V):

+0.12V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2.455 mm

Trade Compliance

BQ24262YFFR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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