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BQ24260YFFT

Texas Instruments

BQ24260YFFT by Texas Instruments

BQ24260YFFT by Texas Instruments is a Power Management IC with 36 terminals, operating b/w -40 to 85°C. It has a nominal voltage of 5V and can handle up to 28V. With adjustable threshold voltage and industrial temperature grade, it's ideal for power supply management circuits in various applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,728 parts In-Stock

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Digiode

USA . 3,766 parts In-Stock

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Native Components

USA . 40 parts In-Stock

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$0.818

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40

$0.818

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Northwest PG Solutions

USA . 779 parts In-Stock

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$0.899

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One Stop Electronics

USA . 861 parts In-Stock

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$1.500

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Ampacity Inc.

Singapore . 1,588 parts In-Stock

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$3.500

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Semicontronic

India . 986 parts In-Stock

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$3.500

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$3.412

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$3.395

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986

$3.500

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AZTECH Wire

Italy . 483 parts In-Stock

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$16.140

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Parana Technologies

USA . 2,130 parts In-Stock

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$18.255

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ChromeModa Solutions

Germany . 6,911 parts In-Stock

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$20.511

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$16.819

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IDEA Electronic Components Group

UK . 1,373 parts In-Stock

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$20.511

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$19.485

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$18.460

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DigiPath Technology Company

USA . 1,164 parts In-Stock

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Microchip USA

USA . 402 parts In-Stock

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Corohmni

South Africa . 391 parts In-Stock

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Corphita

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Overview

Enhance your power management solutions with the BQ24260YFFT by Texas Instruments. As a reputable manufacturer in the industry, Texas Instruments delivers top-quality Power Management ICs that are ideal for a wide range of applications. With a nominal supply voltage of 5V and adjustable threshold features, this product offers unparalleled value and benefits to customers. Say goodbye to overheating and unstable power supplies with the BQ24260YFFT, designed for reliability and efficiency. Choose Texas Instruments for all your power management needs and experience the difference in performance today.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient mounting on PCBs, saving space and simplifying assembly processes.

Nominal Supply Voltage (Vsup): 5 V

Suitable for a wide range of applications while providing a stable power source.

Maximum Operating Temperature: 85 °C

Can withstand high temperature environments, ensuring reliable performance in various conditions.

Minimum Operating Temperature: -40 °C

Can operate in low temperature environments, making it versatile for different settings.

Terminal Pitch: 0.4 mm

Fine pitch terminals allow for high density packing of components, saving space on the PCB.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications where durability and reliability are crucial.

Adjustable Threshold: YES

Allows for customization of threshold voltage, providing flexibility in power management settings.

Technical Specifications

Power Management ICs BQ24260YFFT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

RECHARGE THRESHOLD VOLTAGE IS 0.12V

Adjustable Threshold:

YES

JESD-30 Code:

R-XBGA-B36

JESD-609 Code:

e1

Length:

2.455 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.625 mm

Maximum Supply Voltage (Vsup):

28 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Nominal Threshold Voltage (V):

+0.12V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2.455 mm

Trade Compliance

BQ24260YFFT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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