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BQ24260SYFFT

Texas Instruments

BQ24260SYFFT by Texas Instruments

BQ24260SYFFT by Texas Instruments is a Power Management IC with 36 terminals in a rectangular package. It operates b/w -40 to 85°C, with Vsup ranging from 4.2V to 28V. Ideal for industrial applications requiring precise power supply management and adjustable threshold voltage control.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,176 parts In-Stock

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Digiode

USA . 2,745 parts In-Stock

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2,745

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Distributors (Availability)

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Ampacity Inc.

Singapore . 902 parts In-Stock

1+ parts

$6.500

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902

$6.500

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Semicontronic

India . 1,603 parts In-Stock

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$7.500

100+ parts

$7.312

1k+ parts

$7.275

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1,603

$7.500

$7.312

$7.275

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One Stop Electronics

USA . 248 parts In-Stock

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$7.500

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248

$7.500

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AZTECH Wire

Italy . 662 parts In-Stock

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$8.066

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662

$8.066

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Parana Technologies

USA . 143 parts In-Stock

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$18.669

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$18.761

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143

$18.669

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$18.761

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DigiPath Technology Company

USA . 126 parts In-Stock

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$20.556

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126

$20.556

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ChromeModa Solutions

Germany . 4,469 parts In-Stock

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$20.976

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$17.200

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4,469

$20.976

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IDEA Electronic Components Group

UK . 319 parts In-Stock

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$20.976

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$19.927

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$18.878

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319

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$18.878

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Corphita

USA . 2,541 parts In-Stock

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Northwest PG Solutions

USA . 1,967 parts In-Stock

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Native Components

USA . 703 parts In-Stock

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Microchip USA

USA . 227 parts In-Stock

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Corohmni

South Africa . 131 parts In-Stock

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Overview

Enhance the performance of your power management systems with the BQ24260SYFFT by Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers top-quality Power Management ICs that are designed for reliability and efficiency. This surface-mount device offers a wide range of applications with a compact rectangular package style, making it ideal for various industrial settings. With a nominal supply voltage of 5V and adjustable threshold feature, this IC provides precise power supply management while operating at temperatures as low as -40°C to as high as 85°C. Experience superior performance and value with the BQ24260SYFFT – the perfect solution for your power management needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and compact installation on circuit boards, making this product suitable for use in small electronic devices.

Nominal Supply Voltage (Vsup): 5V

With a stable supply voltage of 5V, this Power Management IC ensures reliable performance and compatibility with a wide range of electronic devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this IC can withstand harsh environmental conditions and maintain optimal functionality in demanding applications.

Width (mm): 4mm

The compact width of 4mm makes this IC suitable for use in space-constrained designs, allowing for more flexibility in layout and integration.

Adjustable Threshold: YES

The adjustable threshold feature allows for customization and fine-tuning of voltage levels, providing versatility and adaptability to different system requirements.

Technical Specifications

Power Management ICs BQ24260SYFFT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

RECHARGE THRESHOLD VOLTAGE IS 0.12V

Adjustable Threshold:

YES

JESD-30 Code:

R-XBGA-B36

JESD-609 Code:

e1

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Current (Isup):

6.5 mA

Maximum Supply Voltage (Vsup):

28 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Nominal Threshold Voltage (V):

+0.15V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4 mm

Trade Compliance

BQ24260SYFFT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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