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BQ24205DGNR

Texas Instruments

BQ24205DGNR by Texas Instruments

BQ24205DGNR by Texas Instruments is a Power Management IC with 8 terminals, operating temperature range of -40 to 125°C. It supports supply voltage from 2.8V to 13.5V and has a max supply current of 2.5mA. Ideal for automotive applications due to its small outline package style and gull wing terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,025 parts In-Stock

1+ parts

-

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3,025

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Vyrian

USA . 2,041 parts In-Stock

1+ parts

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100+ parts

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2,041

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,540 parts In-Stock

1+ parts

$0.500

100+ parts

$0.488

1k+ parts

$0.485

10k+ parts

-

1,540

$0.500

$0.488

$0.485

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Parana Technologies

USA . 1,916 parts In-Stock

1+ parts

$2.378

100+ parts

-

1k+ parts

$2.876

10k+ parts

-

1,916

$2.378

-

$2.876

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IDEA Electronic Components Group

UK . 977 parts In-Stock

1+ parts

$2.672

100+ parts

-

1k+ parts

$2.405

10k+ parts

-

977

$2.672

-

$2.405

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ChromeModa Solutions

Germany . 43 parts In-Stock

1+ parts

$2.672

100+ parts

$2.191

1k+ parts

-

10k+ parts

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43

$2.672

$2.191

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Ampacity Inc.

Singapore . 310 parts In-Stock

1+ parts

$5.500

100+ parts

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310

$5.500

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One Stop Electronics

USA . 380 parts In-Stock

1+ parts

$7.500

100+ parts

-

1k+ parts

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380

$7.500

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AZTECH Wire

Italy . 876 parts In-Stock

1+ parts

$18.977

100+ parts

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10k+ parts

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876

$18.977

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DigiPath Technology Company

USA . 1,971 parts In-Stock

1+ parts

-

100+ parts

$2.409

1k+ parts

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1,971

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$2.409

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Northwest PG Solutions

USA . 1,506 parts In-Stock

1+ parts

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1,506

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Corphita

USA . 444 parts In-Stock

1+ parts

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444

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Corohmni

South Africa . 348 parts In-Stock

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348

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Microchip USA

USA . 226 parts In-Stock

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226

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Native Components

USA . 209 parts In-Stock

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209

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Overview

Looking for a reliable power management solution? Look no further than the BQ24205DGNR by Texas Instruments. With a reputation for quality and innovation, Texas Instruments delivers top-notch products like this one that meet the highest industry standards. Ideal for a wide range of applications in automotive settings and beyond, this Power Management IC offers unmatched value, benefits, and advantages to customers looking for efficient and reliable performance. Trust Texas Instruments to power your next project with the BQ24205DGNR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for efficient and compact PCB design, saving space and improving overall product reliability.

Package Shape: SQUARE

Square package shape ensures easy placement and alignment on the PCB, simplifying manufacturing processes.

No. of Terminals: 8

Having 8 terminals provides enough connectivity options for different power management requirements.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures reliability in both extremely low and high temperature environments.

Terminal Position: DUAL

Dual terminal position offers flexibility in connection options, accommodating diverse circuit configurations.

Width (mm): 3 mm

Compact width allows for efficient use of space on the PCB, enabling more components to be placed for enhanced functionality.

Minimum Supply Voltage (Vsup): 2.8 V

Low minimum supply voltage makes the product suitable for energy-efficient applications, saving power consumption.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature rating ensures reliable performance in automotive applications where temperature fluctuations are common.

Maximum Supply Current (Isup): 2.5 mA

Low maximum supply current helps in reducing power consumption and improving efficiency in power management.

Terminal Form: GULL WING

Gull wing terminal form provides secure soldering connections, ensuring robust electrical connectivity and reliability.

Maximum Supply Voltage (Vsup): 13.5 V

High maximum supply voltage capability allows the product to handle a wide range of input voltage levels, enhancing compatibility with different power sources.

Technical Specifications

Power Management ICs BQ24205DGNR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

OPTIONAL TEMPERATURE MONITORING BEFORE AND DURING CHARGE

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

Length:

3 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.07 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

2.5 mA

Maximum Supply Voltage (Vsup):

13.5 V

Minimum Supply Voltage (Vsup):

2.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3 mm

Trade Compliance

BQ24205DGNR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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