Loading...

BQ24203DGNG4

Texas Instruments

BQ24203DGNG4 by Texas Instruments

BQ24203DGNG4 by Texas Instruments is a Power Management IC with 8 terminals, operating temperature range of -40 to 85°C. It supports power supply circuits, has a small outline package style, and is suitable for industrial applications requiring voltage supply b/w 2.8V to 13.5V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,343 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,343

-

-

-

-

Digiode

USA . 2,496 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,496

-

-

-

-

Euro-Tech

UK . 345 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

345

-

-

-

-

Zilex Electronics Inc.

Canada . 80 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

80

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 299 parts In-Stock

1+ parts

$0.460

100+ parts

-

1k+ parts

-

10k+ parts

$0.442

299

$0.460

-

-

$0.442

One Stop Electronics

USA . 1,327 parts In-Stock

1+ parts

$0.500

100+ parts

-

1k+ parts

-

10k+ parts

-

1,327

$0.500

-

-

-

Northwest PG Solutions

USA . 297 parts In-Stock

1+ parts

$0.506

100+ parts

-

1k+ parts

-

10k+ parts

$0.447

297

$0.506

-

-

$0.447

Andel Nordic

Denmark . 1,041 parts In-Stock

1+ parts

$4.741

100+ parts

-

1k+ parts

$4.551

10k+ parts

$4.551

1,041

$4.741

-

$4.551

$4.551

AZTECH Wire

Italy . 364 parts In-Stock

1+ parts

$10.382

100+ parts

-

1k+ parts

-

10k+ parts

-

364

$10.382

-

-

-

Parana Technologies

USA . 1,507 parts In-Stock

1+ parts

$10.902

100+ parts

$1,012.380

1k+ parts

$9.811

10k+ parts

-

1,507

$10.902

$1,012.380

$9.811

-

DigiPath Technology Company

USA . 1,465 parts In-Stock

1+ parts

$12.004

100+ parts

-

1k+ parts

-

10k+ parts

-

1,465

$12.004

-

-

-

IDEA Electronic Components Group

UK . 1,891 parts In-Stock

1+ parts

$12.249

100+ parts

$11.637

1k+ parts

$11.024

10k+ parts

-

1,891

$12.249

$11.637

$11.024

-

ChromeModa Solutions

Germany . 1,746 parts In-Stock

1+ parts

$12.249

100+ parts

$10.044

1k+ parts

-

10k+ parts

-

1,746

$12.249

$10.044

-

-

Corphita

USA . 3,718 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,718

-

-

-

-

Microchip USA

USA . 1,976 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,976

-

-

-

-

Overview

Experience the superior quality and innovation of Texas Instruments with the BQ24203DGNG4 Power Management IC. This cutting-edge product offers unparalleled efficiency and reliability, perfect for a wide range of applications in various industries. With a focus on providing value and benefits to customers, this small outline package with heat sink/slug design ensures optimal performance even in demanding environments. Trust Texas Instruments to deliver top-of-the-line power supply support circuits that exceed expectations and set new standards in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly.

Package Shape: SQUARE

The square shape helps in efficient space utilization on the PCB.

No. of Terminals: 8

Having 8 terminals provides flexibility in connecting various components.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the reliability of the IC in various environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold finish ensures good electrical conductivity and corrosion resistance.

Terminal Position: DUAL

Having dual terminal positions provides redundancy and flexibility in connection options.

Maximum Seated Height: 1.07 mm

The low seated height allows for a compact design and efficient use of space.

Width (mm): 3 mm

The narrow width makes this IC suitable for applications where space is limited.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being a power supply support circuit, this IC is essential for stable power management in electronic devices.

Minimum Supply Voltage (Vsup): 2.8 V

The low minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Time At Peak Reflow Temperature (s): 30

Being able to withstand peak reflow temperature for up to 30 seconds allows for effective soldering during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability ensures reliable solder joints during assembly.

Length: 3 mm

The compact length makes this IC suitable for applications with limited PCB space.

Temperature Grade: INDUSTRIAL

Being industrial grade, this IC can withstand harsh operating conditions in industrial environments.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy and reliable soldering during assembly.

Terminal Pitch: 0.65 mm

The fine terminal pitch allows for high-density mounting on the PCB.

Maximum Supply Voltage (Vsup): 13.5 V

The high maximum supply voltage capability makes this IC suitable for a wide range of power input sources.

Technical Specifications

Power Management ICs BQ24203DGNG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

OPTIONAL TEMPERATURE MONITORING BEFORE AND DURING CHARGE

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.07 mm

Maximum Supply Voltage (Vsup):

13.5 V

Minimum Supply Voltage (Vsup):

2.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

BQ24203DGNG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20