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BQ24201DGNRG4

Texas Instruments

BQ24201DGNRG4 by Texas Instruments

BQ24201DGNRG4 by Texas Instruments is a Power Management IC with 8 terminals, operating b/w -40 to 125°C. It supports supply voltage from 2.8V to 13.5V and draws a max current of 2.5mA. Ideal for automotive applications due to its small size and heat sink package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,088 parts In-Stock

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6,088

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Digiode

USA . 2,604 parts In-Stock

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2,604

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Distributors (Availability)

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Native Components

USA . 19 parts In-Stock

1+ parts

$0.429

100+ parts

-

1k+ parts

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$0.412

19

$0.429

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-

$0.412

Northwest PG Solutions

USA . 559 parts In-Stock

1+ parts

$0.472

100+ parts

-

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-

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$0.416

559

$0.472

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-

$0.416

Ampacity Inc.

Singapore . 1,380 parts In-Stock

1+ parts

$4.500

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1,380

$4.500

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One Stop Electronics

USA . 1,355 parts In-Stock

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$5.500

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1,355

$5.500

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AZTECH Wire

Italy . 778 parts In-Stock

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$6.494

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778

$6.494

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Semicontronic

India . 1,384 parts In-Stock

1+ parts

$6.500

100+ parts

$6.338

1k+ parts

$6.305

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-

1,384

$6.500

$6.338

$6.305

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Parana Technologies

USA . 58 parts In-Stock

1+ parts

$17.687

100+ parts

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$17.874

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58

$17.687

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$17.874

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DigiPath Technology Company

USA . 259 parts In-Stock

1+ parts

$19.476

100+ parts

$17.917

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259

$19.476

$17.917

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ChromeModa Solutions

Germany . 6,174 parts In-Stock

1+ parts

$19.873

100+ parts

$16.296

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6,174

$19.873

$16.296

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IDEA Electronic Components Group

UK . 1,271 parts In-Stock

1+ parts

$19.873

100+ parts

$18.879

1k+ parts

$17.886

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1,271

$19.873

$18.879

$17.886

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Corphita

USA . 4,365 parts In-Stock

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Corohmni

South Africa . 157 parts In-Stock

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Microchip USA

USA . 117 parts In-Stock

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117

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Overview

Unlock the power of efficient charging with the BQ24201DGNRG4 by Texas Instruments. Crafted with precision and reliability, this Power Management IC offers unparalleled performance in various applications. From automotive to industrial settings, this product ensures optimal power supply support without compromising on quality. Experience seamless operation and enhanced productivity with the BQ24201DGNRG4, a must-have for those seeking top-notch solutions in power management.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during manufacturing.

Package Shape: SQUARE

Square shape enables efficient use of space on the circuit board, making the product compact and ideal for applications with limited space.

No. of Terminals: 8

Sufficient number of terminals for connections, offering versatility and compatibility with various circuit configurations.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for use in demanding environments where heat resistance is crucial.

Minimum Operating Temperature: -40 °C

Designed to operate effectively in low-temperature conditions, ensuring reliability in a wide range of environments.

Terminal Position: DUAL

Dual terminal positioning provides stability and secure connections, enhancing the performance and safety of the product.

Width (mm): 3 mm

Narrow width allows for easy placement on the circuit board and conserves space, making it suitable for compact electronic devices.

Minimum Supply Voltage (Vsup): 2.8 V

Operates efficiently at low supply voltages, reducing power consumption and enabling energy-efficient performance.

Temperature Grade: AUTOMOTIVE

Meets automotive industry standards for temperature resistance and performance, ensuring reliable operation in automotive applications.

Maximum Supply Current (Isup): 2.5 mA

Low supply current consumption helps conserve power and extends battery life, making the product suitable for portable devices.

Terminal Form: GULL WING

Gull wing terminal form offers secure and reliable connections, reducing the risk of disconnections or electrical faults.

Maximum Supply Voltage (Vsup): 13.5 V

Can handle high supply voltages, providing versatility and compatibility with a wide range of power sources.

Technical Specifications

Power Management ICs BQ24201DGNRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

OPTIONAL TEMPERATURE MONITORING BEFORE AND DURING CHARGE

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

Length:

3 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.07 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

2.5 mA

Maximum Supply Voltage (Vsup):

13.5 V

Minimum Supply Voltage (Vsup):

2.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3 mm

Trade Compliance

BQ24201DGNRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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