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BQ24201DGN

Texas Instruments

BQ24201DGN by Texas Instruments

BQ24201DGN by Texas Instruments is a Power Management IC with 8 terminals in a small outline package. It operates b/w -40 to 85°C, supporting supply voltages from 2.8V to 13.5V. Ideal for industrial applications requiring efficient power supply support circuits.

Median Price

$5.828

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 106 parts In-Stock

1+ parts

$8.380

100+ parts

$5.580

1k+ parts

-

10k+ parts

$5.260

106

$8.380

$5.580

-

$5.260

Rochester

USA . 7,857 parts In-Stock

1+ parts

-

100+ parts

$4.540

1k+ parts

$4.060

10k+ parts

$3.820

7,857

-

$4.540

$4.060

$3.820

Verical

USA . 3,920 parts In-Stock

1+ parts

-

100+ parts

$5.675

1k+ parts

$5.075

10k+ parts

$4.775

3,920

-

$5.675

$5.075

$4.775

DigiKey

USA . 170 parts In-Stock

1+ parts

-

100+ parts

$5.980

1k+ parts

-

10k+ parts

-

170

-

$5.980

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,586 parts In-Stock

1+ parts

$4.351

100+ parts

-

1k+ parts

-

10k+ parts

-

4,586

$4.351

-

-

-

Vyrian

USA . 4,911 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,911

-

-

-

-

DigiKey Marketplace

USA . 170 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

170

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,080 parts In-Stock

1+ parts

$4.122

100+ parts

-

1k+ parts

-

10k+ parts

-

3,080

$4.122

-

-

-

Parana Technologies

USA . 2,213 parts In-Stock

1+ parts

$8.723

100+ parts

-

1k+ parts

$9.405

10k+ parts

-

2,213

$8.723

-

$9.405

-

DigiPath Technology Company

USA . 119 parts In-Stock

1+ parts

$9.605

100+ parts

$8.837

1k+ parts

-

10k+ parts

-

119

$9.605

$8.837

-

-

ChromeModa Solutions

Germany . 6,116 parts In-Stock

1+ parts

$9.801

100+ parts

$8.037

1k+ parts

-

10k+ parts

-

6,116

$9.801

$8.037

-

-

IDEA Electronic Components Group

UK . 1,197 parts In-Stock

1+ parts

$9.801

100+ parts

$9.311

1k+ parts

$8.821

10k+ parts

-

1,197

$9.801

$9.311

$8.821

-

Glotronic Ltd.

UK . 3,790 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,790

-

-

-

-

Native Components

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Perfect Parts

USA . 386 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

386

-

-

-

-

Robosynatics

Brazil . 200 parts In-Stock

1+ parts

-

100+ parts

$7.755

1k+ parts

$7.181

10k+ parts

$7.181

200

-

$7.755

$7.181

$7.181

Lucentia Tech

USA . 200 parts In-Stock

1+ parts

-

100+ parts

$7.755

1k+ parts

$7.181

10k+ parts

$7.181

200

-

$7.755

$7.181

$7.181

Northwest PG Solutions

USA . 199 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

199

-

-

-

-

Overview

Enhance your power management solutions with the BQ24201DGN by Texas Instruments. This top-quality product boasts cutting-edge technology from a reputable manufacturer, ensuring reliability and efficiency. Ideal for a wide range of applications, this Power Management IC offers exceptional value, benefits, and advantages to customers seeking high-performance components. Upgrade your devices with confidence and experience the difference with the BQ24201DGN.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for internal components.

Surface Mount: YES

Allows for easy installation onto circuit boards.

Package Shape: SQUARE

Compact design for space-saving applications.

No. of Terminals: 8

Sufficient terminals for connection to other components.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Enhances thermal performance and efficiency.

Maximum Operating Temperature: 85 °C

Reliable operation in high-temperature environments.

Minimum Operating Temperature: -40 °C

Suitable for use in low-temperature conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Ensures good conductivity and corrosion resistance.

Terminal Position: DUAL

Allows for flexible installation options.

Maximum Seated Height: 1.07 mm

Low-profile design for compact devices.

Width (mm): 3 mm

Narrow width for space-constrained applications.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Specifically designed for power management tasks.

Minimum Supply Voltage (Vsup): 2.8 V

Works with a wide range of supply voltages.

Maximum Time At Peak Reflow Temperature (s): 30

Optimal reflow process for reliable solder joints.

Peak Reflow Temperature °C: 260

Ideal reflow temperature for soldering purposes.

Length: 3 mm

Compact length for space-saving designs.

Temperature Grade: INDUSTRIAL

Suitable for industrial-grade applications.

Terminal Form: GULL WING

Easy soldering and secure connection to PCB.

Terminal Pitch: 0.65 mm

Fine pitch for high-density mounting.

Maximum Supply Voltage (Vsup): 13.5 V

Supports higher supply voltages for various applications.

Technical Specifications

Power Management ICs BQ24201DGN attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

OPTIONAL TEMPERATURE MONITORING BEFORE AND DURING CHARGE

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.07 mm

Maximum Supply Voltage (Vsup):

13.5 V

Minimum Supply Voltage (Vsup):

2.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

BQ24201DGN Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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