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BQ24188YFFR

Texas Instruments

BQ24188YFFR by Texas Instruments

BQ24188YFFR by Texas Instruments is a Power Management IC with 36 terminals, operating b/w -40 to 85°C. It has a nominal voltage of 5V and supports a max supply current of 6.65mA. Ideal for industrial applications requiring precise power supply management in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,444 parts In-Stock

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Digiode

USA . 3,418 parts In-Stock

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Native Components

USA . 954 parts In-Stock

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$0.419

100+ parts

-

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$0.402

954

$0.419

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$0.402

Northwest PG Solutions

USA . 488 parts In-Stock

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$0.461

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-

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$0.406

488

$0.461

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$0.406

Semicontronic

India . 1,451 parts In-Stock

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$4.500

100+ parts

$4.388

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$4.365

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$4.500

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One Stop Electronics

USA . 776 parts In-Stock

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$5.500

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776

$5.500

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AZTECH Wire

Italy . 835 parts In-Stock

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$7.029

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835

$7.029

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Parana Technologies

USA . 1,999 parts In-Stock

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$9.632

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$10.225

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$9.632

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$10.225

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DigiPath Technology Company

USA . 207 parts In-Stock

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$10.606

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$9.757

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$10.606

$9.757

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ChromeModa Solutions

Germany . 3,794 parts In-Stock

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$10.822

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$8.874

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$8.874

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IDEA Electronic Components Group

UK . 284 parts In-Stock

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$10.822

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$10.281

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$9.740

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284

$10.822

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QUARKTWIN TECHNOLOGY LTD

USA . 9,370 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,800 parts In-Stock

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Corphita

USA . 4,928 parts In-Stock

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Robosynatics

Brazil . 500 parts In-Stock

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Lucentia Tech

USA . 500 parts In-Stock

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$22.804

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$21.117

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$21.117

500

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$21.117

$21.117

Corohmni

South Africa . 460 parts In-Stock

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Microchip USA

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Kepictronics

USA . 60 parts In-Stock

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Overview

Discover the cutting-edge BQ24188YFFR Power Management IC by Texas Instruments, setting the standard for quality and innovation. Ideal for a wide range of applications, this sleek rectangular package offers customers unparalleled value and benefits in managing power supply. With its industrial-grade temperature grade and adjustable threshold, this product ensures optimal performance and reliability. Trust Texas Instruments to provide top-of-the-line solutions for your power management needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount package allows for easy and convenient installation on PCBs, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 5 V

Operates at a common and widely available voltage, making integration into existing systems easier.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial applications where heat may be a concern.

Minimum Operating Temperature: -40 °C

Capable of operating in extremely cold conditions, providing flexibility for use in a wide range of environments.

Maximum Supply Voltage (Vsup): 28 V

Can accommodate a higher supply voltage, allowing for use in a variety of power management applications.

Technical Specifications

Power Management ICs BQ24188YFFR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-XBGA-B36

JESD-609 Code:

e1

Length:

2.455 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.625 mm

Maximum Supply Current (Isup):

6.65 mA

Maximum Supply Voltage (Vsup):

28 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Nominal Threshold Voltage (V):

+0.15V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2.455 mm

Trade Compliance

BQ24188YFFR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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