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BQ24185YFFR

Texas Instruments

BQ24185YFFR by Texas Instruments

BQ24185YFFR by Texas Instruments is a Power Management IC with 25 terminals, operating b/w -40 to 85°C. It has a rectangular package style, very thin profile, and fine pitch grid array. Suitable for industrial applications, it supports a supply voltage range of 4-16V and features an adjustable threshold with buck switcher configuration.

Median Price

$3.386

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,950 parts In-Stock

1+ parts

$4.507

100+ parts

$3.949

1k+ parts

$2.231

10k+ parts

-

5,950

$4.507

$3.949

$2.231

-

Rochester

USA . 63,000 parts In-Stock

1+ parts

-

100+ parts

$2.780

1k+ parts

$2.490

10k+ parts

$2.340

63,000

-

$2.780

$2.490

$2.340

DigiKey

USA . 63,000 parts In-Stock

1+ parts

-

100+ parts

$3.660

1k+ parts

-

10k+ parts

-

63,000

-

$3.660

-

-

Verical

USA . 63,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.112

10k+ parts

$2.925

63,000

-

-

$3.112

$2.925

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,490 parts In-Stock

1+ parts

$2.945

100+ parts

-

1k+ parts

-

10k+ parts

-

4,490

$2.945

-

-

-

DigiKey Marketplace

USA . 63,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

63,000

-

-

-

-

Vyrian

USA . 8,205 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,205

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,362 parts In-Stock

1+ parts

$2.790

100+ parts

-

1k+ parts

-

10k+ parts

-

2,362

$2.790

-

-

-

Parana Technologies

USA . 705 parts In-Stock

1+ parts

$12.150

100+ parts

-

1k+ parts

$12.562

10k+ parts

-

705

$12.150

-

$12.562

-

DigiPath Technology Company

USA . 594 parts In-Stock

1+ parts

$13.379

100+ parts

$12.309

1k+ parts

-

10k+ parts

-

594

$13.379

$12.309

-

-

IDEA Electronic Components Group

UK . 1,866 parts In-Stock

1+ parts

$13.652

100+ parts

$12.969

1k+ parts

$12.287

10k+ parts

-

1,866

$13.652

$12.969

$12.287

-

ChromeModa Solutions

Germany . 1,694 parts In-Stock

1+ parts

$13.652

100+ parts

$11.195

1k+ parts

-

10k+ parts

-

1,694

$13.652

$11.195

-

-

Microchip USA

USA . 1,295 parts In-Stock

1+ parts

$19.480

100+ parts

$19.360

1k+ parts

$19.300

10k+ parts

$19.240

1,295

$19.480

$19.360

$19.300

$19.240

A-Z Elektronik GmbH

Germany . 5,996 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,996

-

-

-

-

Alle Elektronik GmbH

Germany . 3,997 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,997

-

-

-

-

Perfect Parts

USA . 2,720 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,720

-

-

-

-

Northwest PG Solutions

USA . 1,973 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,973

-

-

-

-

Native Components

USA . 861 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

861

-

-

-

-

Kepictronics

USA . 180 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

180

-

-

-

-

Overview

Enhance your power management capabilities with the BQ24185YFFR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability. This Power Management IC is perfect for various applications, providing efficient performance and precise control. With its surface mount feature and compact package shape, this product offers convenience and versatility. Trust Texas Instruments to deliver superior products that meet your needs and exceed your expectations. Elevate your power management solutions with the BQ24185YFFR.

Feature Benefit Bullets

Surface Mount: YES

Being surface mountable makes it easier to integrate into compact electronic designs, saving space on the PCB.

Nominal Supply Voltage (Vsup): 5 V

The 5V supply voltage is a common standard in many electronic devices, making it compatible with a wide range of applications.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style offers high density mounting and efficient thermal performance, which is beneficial for power management ICs that may generate heat.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in harsh environmental conditions.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides good conductivity and corrosion resistance for long-lasting performance.

Width (mm): 2.2 mm

The compact width allows for efficient use of board space and enables the IC to be used in smaller, more streamlined designs.

Maximum Supply Voltage (Vsup): 16 V

The high maximum supply voltage makes this power management IC suitable for a wide range of application scenarios requiring different voltage levels.

Adjustable Threshold: YES

The ability to adjust the threshold allows for customization and flexibility in power management settings, making the IC versatile for various requirements.

Technical Specifications

Power Management ICs BQ24185YFFR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-XBGA-B25

JESD-609 Code:

e1

Length:

2.4 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

25

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.625 mm

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Switcher Config:

BUCK

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2.2 mm

Trade Compliance

BQ24185YFFR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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